Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Page Size | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
IS42S16400D-6TLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | Obsolete | 2 (1 Year) | 54 | EAR99 | 3.3V | 1 | 22.22mm | RoHS Compliant | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 64 Mb | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3.3V | 10 | 54 | 0.8mm | 3V | Not Qualified | 3.6V | 3-STATE | 5ns | 64Mb 4M x 16 | Volatile | 14b | 3V~3.6V | 4MX16 | 16 | 16b | 166MHz | 0.003A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||
.png "AS4C256M32MD2-18BCNTR") |
AS4C256M32MD2-18BCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 134-VFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | 134-FBGA (11.5x11.5) | 8Gb 256M x 32 | Volatile | 1.2V 1.8V | 533MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7007L20PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | yes | Active | 3 (168 Hours) | 80 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 80 | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 315mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 5V | 30 | 80 | INDUSTRIAL | 0.65mm | SRAMs | 5V | 3-STATE | 20 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.01A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9199L7PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 1.1 Mb | 45.45MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 18 ns | RAM, SRAM | 17b | Synchronous | 9b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||
 |
70T3519S200BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 2.5V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 200MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 525mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 3.4 ns | 200MHz | 1.1MB | RAM, SDR, SRAM | 36b | Synchronous | 0.015A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
 |
70V34L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 185mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | 9kB | RAM, SDR, SRAM | 24b | 4KX18 | Asynchronous | 18b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA166BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 360mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
 |
71024S12TYGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 32 | 85°C | -40°C | 5V | 1 | 21.95mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 5.5V | 4.5V | 1 Mb | 7.6mm | 2.67mm | CMOS | 3.759mm | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 30 | 32 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7006L20PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 320mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||
 |
7024L15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||
 |
7005L20PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2005 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | YES | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | 0.0015A | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||
 |
7024S15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | Asynchronous | 0.015A | 16b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
 |
709079L12PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM | 30b | Synchronous | 0.005A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V256SA12YI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | no | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 28 | INDUSTRIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.09mA | 32KX8 | 8 | 262144 bit | 0.002A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V06L55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 128 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||
|
MT53D384M16D1Z1AMWC1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3558S200PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3558 | 3.2ns | 4.5Mb 256K x 18 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71V124SA12YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2013 | yes | Active | 3 (168 Hours) | 32 | 85°C | -40°C | 3.3V | 1 | 20.9mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3V | 1 Mb | 10.2mm | 2.2mm | CMOS | 3.683mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | INDUSTRIAL | YES | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25VQ16CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7140LA35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||
|
IS61WV102416FBLL-10T2LI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 54 | 22.22mm | ROHS3 Compliant | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 1.2mm | 1 | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G54 | 2.4V | 3.6V | 16Mb 1M x 16 | Volatile | 2.4V~3.6V | 1MX16 | 16 | 16777216 bit | 10 ns | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W631GU6KB-15 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-TFBGA | 9mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | 96 | YES | 0.8mm | R-PBGA-B96 | 1.283V | Not Qualified | 1.35V | 1.45V | 3-STATE | 20ns | 1Gb 64M x 16 | Volatile | 0.38mA | 1.283V~1.45V | 64MX16 | 16 | 1073741824 bit | 667MHz | 0.014A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||
 |
N25Q128A13ESFA0F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2014 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~125°C TA | FLASH - NOR | N25Q128A13 | 128Mb 32M x 4 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI | 8ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
N25Q256A11ESF40G | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2013 | yes | Obsolete | 3 (168 Hours) | 16 | 1.8V | 10.3mm | ROHS3 Compliant | No | 16 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 256 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2.5mm | 1 | 20mA | DUAL | 260 | 1.8V | 30 | N25Q256A11 | YES | 1.27mm | 1.7V | 8 ns | 256Mb 64M x 4 | Non-Volatile | 1b | 1.7V~2V | 256MX1 | 1 | Synchronous | 108MHz | 0.00002A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | FLASH | SPI | 8ms, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61LF12836A-7.5B2I-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 2 (1 Year) | 85°C | -40°C | Non-RoHS Compliant | 119 | 119-BBGA | Parallel | 3.465V | 3.135V | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 117MHz | 119-PBGA (14x22) | 7.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.6V | 117MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71V67703S80BG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V67703 | 119-PBGA (14x22) | 8ns | 9Mb 256K x 36 | Volatile | 3.135V~3.465V | 100MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CAT24S64C4ATR | ON Semiconductor | 1.1403 |
Min: 1 Mult: 1 |
0.00000000 | download | ACTIVE (Last Updated: 2 months ago) | Tape & Reel (TR) | 2014 | yes | Active | 1 (Unlimited) | 4 | 0.85mm | ROHS3 Compliant | LG-MAX, WD-MAX, ALSO AVAILABLE 1.6-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ | 0.85mm | CMOS | SYNCHRONOUS | 0.35mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 5V | INDUSTRIAL | YES | 0.4mm | S-PBGA-B4 | 1.7V | 85°C | -40°C | 5.5V | 8KX8 | 8 | 65536 bit | EEPROM | SERIAL | 1MHz | 5ms | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761S200BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel | 2009 | yes | Discontinued | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 200MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 360mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.1 ns | RAM, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
M27C1001-45XC1 | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 3 (168 Hours) | 32 | EAR99 | 5V | 13.97mm | ROHS3 Compliant | 32 | 00.1.142 | 32-LCC (J-Lead) | 11.43mm | Surface Mount | 0°C~70°C TA | EPROM - OTP | ASYNCHRONOUS | 3.56mm | 1 | e3 | Matte Tin (Sn) | QUAD | NOT SPECIFIED | 5V | NOT SPECIFIED | M27C1001 | 32 | YES | 1.27mm | OTP ROMs | Not Qualified | 5V | 3-STATE | 45ns | 1Mb 128K x 8 | Non-Volatile | 0.03mA | 4.75V~5.25V | 128KX8 | 8 | 1048576 bit | 0.0001A | COMMON | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T659S12BFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 2.6V | 2.4V | 4.5 Mb | 15mm | 1.4mm | CMOS | 1.5mm | 1 | 395mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 34b | Asynchronous | 36b | COMMON |
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