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  • STM32F103C8T6
  • MFI343S00177
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  • STM32F407VET6
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RF Directional Coupler

Additional Feature

  • HIGH ISOLATION
  • HIGH RELIABILITY
  • IT CAN ALSO OPERATE AT 1700-1800 MHZ
  • N
  • N, I/P POWER-MAX(PEAK)=2000WATT
  • N, I/P POWER-MAX(PEAK)=3000WATT
  • N, I/P POWER-MAX(PEAK)=4000WATT
  • N-F
  • N-F, I/P POWER-MAX(PEAK)=10000WATT
  • N-F, I/P POWER-MAX(PEAK)=5000WATT
  • N-F; N-M, I/P POWER-MAX (PEAK)=5000WATT
  • N-F; N-M, I/P POWER-MAX(PEAK)=3000WATT
  • SMA
  • SMA, I/P POWER-MAX(PEAK)=2000WATT
  • SMA, I/P POWER-MAX(PEAK)=3000WATT
  • SMA, I/P POWER-MAX(PEAK)=4000WATT
  • SMA-F
  • SMA-F, HIGH ISOLATION
  • SMA-F, I/P POWER-MAX(PEAK)=1000WATT
  • SMA-F, I/P POWER-MAX(PEAK)=2000WATT
  • SMA-F, I/P POWER-MAX(PEAK)=3000WATT
  • SMA-F; TNC-F; TNC-M, I/P POWER-MAX (PEAK)=3000WATT
  • SMA-F; TNC-F; TNC-M, I/P POWER-MAX (PEAK)=5000WATT
  • TNC
  • TNC, I/P POWER-MAX(PEAK)=2000WATT
  • TNC, I/P POWER-MAX(PEAK)=3000WATT
  • TNC, I/P POWER-MAX(PEAK)=4000WATT
  • TNC-F

Applications

  • -
  • AGSM, DCS, PCS
  • AGSM, GSM
  • AMPS
  • AMPS, CDMA, WCDMA
  • AMPS, GSM, LTE, WCDMA
  • CATV
  • CATV, Cellular
  • CDMA
  • CDMA, DCS, GPS, ISM, PCS, TDMA, UMTS
  • CDMA, PCS, DCS
  • CDMA, WCDMA
  • Cellular
  • Cellular, PCN, PCS
  • Cellular, PCS
  • DCS
  • DCS, LTE, PCS, WCDMA
  • DCS, LTE, PCS, WiMax
  • DCS, PCS
  • DCS, PCS, WCDMA
  • DECT
  • E-GSM
  • General Purpose
  • GPS
  • GSM
  • GSM, LTE
  • GSM, W-CDMA, WiMax
  • LTE, WiMAX
  • LTE, WWAN
  • Military
  • PCN
  • PCN, PCS
  • PCS
  • PCS, LTE, ISM, UMTS, WiMAX, Wi-Fi
  • PDC
  • PHP
  • S-Band Radar
  • Telecom/Datacom Systems
  • UMTS
  • W-CDMA
  • Wireless LAN
  • WLAN
  • X-Band Radar

Composition

  • Ceramic
  • Thin Film

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 5A991.G
  • EAR99

Factory Lead Time

  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 5 Weeks
  • 6 Weeks
  • 8 Weeks
  • 9 Weeks

HTS Code

  • 8517.70.00.00
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e3
  • e4

Lifecycle Status

  • ACTIVE (Last Updated: 8 months ago)
  • EOL ANNOUNCED (Last Updated: 2 months ago)
  • NRND (Last Updated: 1 month ago)
  • NRND (Last Updated: 3 weeks ago)
  • OBSOLETE (Last Updated: 1 month ago)
  • PRODUCTION (Last Updated: 2 months ago)
  • PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)
  • PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 2 months ago)

Manufacturer Package Identifier

  • X3C19P2-30S

Max Operating Temperature

  • 85°C
  • 95°C

Mfr

  • Johanson Technology Inc.
  • KYOCERA AVX
  • MACOM Technology Solutions
  • Mini-Circuits
  • Murata Electronics
  • Pulse Electronics
  • Radiall USA, Inc.
  • Taiyo Yuden
  • TDK Corporation

Min Operating Temperature

  • -30°C
  • -40°C
  • -50°C
  • -55°C

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2 (1 Year)
  • 2 (1 Year)
  • Not Applicable
  • Vendor Undefined

Mount

  • Screw
  • Surface Mount

Mounting Feature

  • SURFACE MOUNT

Number of Pins

  • 10
  • 4
  • 5
  • 6
  • 8

Number of Terminations

  • 4
  • 6

Package / Case

  • -
  • 0202 (0505 Metric), 4 PC Pad
  • 0302 (0806 Metric), 4 Lead
  • 0402
  • 0402 (1005 Metric)
  • 0402 (1005 Metric), 4 PC Pad
  • 0402 (1005 Metric), 6 PC Pad
  • 0603
  • 0603 (1608 Metric)
  • 0603 (1608 Metric), 4 PC Pad
  • 0603 (1608 Metric), 6 PC Pad
  • 0606 (1616 Metric)
  • 0805
  • 0805 (2012 Metric)
  • 0805 (2012 Metric), 4 PC Pad
  • 0805 (2012 Metric), 8 PC Pad
  • 100
  • 1206 (3216 Metric)
  • 1210 (3225 Metric)
  • 125
  • 200
  • 24-VFQFN Exposed Pad
  • 2520 (6450 Metric)
  • 4-SMD
  • 4-SMD, Flat Leads
  • 4-SMD, Gull Wing
  • 4-SMD, No Lead
  • 4-SMD, No Lead Exposed Pad
  • 5-SMD Module
  • 5-SMD, No Lead
  • 5-UFBGA, FCBGA
  • 6-SMD
  • 6-SMD (5 Leads), Flat Lead
  • 6-SMD (5 Leads), Gull Wing
  • 6-SMD Module
  • 6-SMD Module, No Lead
  • 6-SMD, Flat Leads
  • 6-SMD, No Lead
  • 6-UFBGA, FCBGA
  • 6-VFDFN Exposed Pad
  • 6-WFBGA, FCBGA
  • 6-WFDFN Exposed Pad
  • 7-WFBGA, FCBGA
  • 8-SMD, J-Lead
  • 8-SMD, No Lead
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-UFBGA, FCBGA
  • Flat Box, Terminator
  • FlatPack
  • FP-2
  • LGA
  • Module
  • Module, SMA Connectors
  • N-Type In-Line Module
  • Nonstandard
  • SC-74, SOT-457
  • SF-1
  • SM-22
  • SM-55
  • SMA
  • SMA In-Line Module
  • SMD/SMT
  • SOT-23-6
  • TNC In-Line Module

Packaging

  • Box
  • Bulk
  • Cut Tape (CT)
  • Digi-Reel®
  • Strip
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray

Packing Method

  • TR, EMBOSSED, 7 INCH

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • *
  • -
  • 1608
  • 2020
  • 605
  • FI
  • HDH
  • HHM
  • SURFCOIL® GLSL
  • TSC1
  • Xinger III®
  • Xinger II®
  • Xinger®
  • Xinger® IV

Supplier Device Package

  • -
  • 0202
  • 0402
  • 0603
  • 0603 (1608 Metric)
  • 0805
  • 0805 (2012 Metric)
  • 1206
  • 6-SMD
  • 6-TDFN (1.5x1.2)
  • 8-SOIC
  • FP-2
  • Module
  • SF-1
  • SM-22
  • SM-55
  • SMD

Surface Mount

  • YES

Terminal Finish

  • GOLD
  • Gold (Au)
  • Gold (Au) - with Nickel (Ni) barrier
  • Matte Tin (Sn)
  • MATTE TIN OVER COPPER
  • Nickel/Gold (Ni/Au) - ENIG
  • TIN
  • Tin (Sn)
  • Tin (Sn) - immersion
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn10Pb90)
  • Tin/Lead (Sn63Pb37)
  • Tin/Silver/Copper (Sn/Ag/Cu)

Termination

  • SMD/SMT
  • Through Hole

Weight

  • 2.012816mg
  • 5.499807mg
  • 50.008559mg
  • 652.039032μg
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations Termination Max Operating Temperature Min Operating Temperature RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Frequency Impedance Mfr Technology JESD-609 Code Terminal Finish Surface Mount Operating Temperature (Max) Operating Temperature (Min) Max Power Dissipation Power - Max Mounting Feature Composition Case Code (Metric) Case Code (Imperial) Characteristic Impedance Construction RF/Microwave Device Type Operating Frequency-Max Operating Frequency-Min VSWR-Max Input Power-Max (CW) Insertion Loss (Max) Insertion Loss Applications Supplier Device Package Insertion Loss (dB) Return Loss Isolation Coupler Type Coupling Factor
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