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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Reach Compliance Code Lead Pitch Height Width Mounting Type Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
317-43-110-41-005000 317-43-110-41-005000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 download 3 Weeks 2013 yes Active EAR99 ROHS3 Compliant Contains Lead 8536.90.40.00 IC SOCKET
551-90-173-16-005004 551-90-173-16-005004 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 TIN LEAD (200) OVER NICKEL (150) 173 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET PGA173
551-90-153-15-061004 551-90-153-15-061004 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 TIN LEAD (200) OVER NICKEL (150) 153 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET PGA153
66-PLS11054-12 66-PLS11054-12 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS) Bulk 2016 PLS Active 1 (Unlimited) Solder 125°C -65°C Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole -65°C~125°C PGA, ZIF (ZIP) 3.175mm Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
116-47-652-41-007000 116-47-652-41-007000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
550-80-191-18-091101 550-80-191-18-091101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 550 Active 1 (Unlimited) Solder EAR99 Tin 191 ROHS3 Compliant STANDARD: UL 94V-0 not_compliant Through Hole -55°C~125°C 8536.69.40.40 10mOhm PGA e3 Open Frame 1A UL94 V-0 0.100 2.54mm 191 (18 x 18) Beryllium Copper Brass 0.164 4.16mm 0.100 2.54mm
517-87-475-21-121111 517-87-475-21-121111 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 517 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 475 Through Hole -55°C~125°C 10mOhm PGA 3.175mm Open Frame UL94 V-0 0.100 2.54mm Tin Flash 475 (21 x 21) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
515-91-133-14-071003 515-91-133-14-071003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
104-13-314-41-770000 104-13-314-41-770000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Thermoplastic Tube 2010 104 yes Active 1 (Unlimited) Press-Fit EAR99 125°C -55°C Gold Straight 10.1mm 14 17.7mm ROHS3 Compliant Copper 3A 14 DIP SOCKET 10.2mm Through Hole 150V 100V 8536.90.40.00 10mOhm 10GOhm DIP, 0.3 (7.62mm) Row Spacing e4 Polychlorinated 2 Open Frame 7.62 mm 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass Alloy 0.175 4.45mm 0.100 2.54mm
32-C212-31 32-C212-31 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 EJECT-A-DIP™ yes Active 1 (Unlimited) Wire Wrap EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A 32 LATCHED, UL 94V-0 Through Hole -55°C~125°C 1000000000Ohm DIP, 0.6 (15.24mm) Row Spacing 1.016mm e4 1.89 inch 0.7 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch 1000VAC V Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 32 (2 x 16) Beryllium Copper Brass 0.040 1.02mm 0.100 2.54mm
522-93-028-06-005001 522-93-028-06-005001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active 28 EAR99 28 Non-RoHS Compliant NOT SPECIFIED Gold 1A PGA SOCKET 2.54mm 8536.90.40.00 10000000000Ohm e0 125°C -55°C 0.6 inch 0.6 inch STRAIGHT RECTANGULAR 0.193 inch RND PIN-SKT 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 2.54mm WIRE WRAP 0.1 mm IC SOCKET 6X6
510-13-068-11-061002 510-13-068-11-061002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 68 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA68
APA-308-G-K APA-308-G-K Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole Bulk yes Active Not Applicable EAR99 125°C -55°C Male Straight 10.03mm 8 10.16mm ROHS3 Compliant Brass Gold 1A STANDARD: UL 94V-0 5GOhm e4 Polyester 2 2.54mm 7.62 mm IC SOCKET
18-3513-10H 18-3513-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2015 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 3A 18 LOW PROFILE; UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 2.54mm 1.8 inch 0.4 inch RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.3 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 18 (2 x 9) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
110-11-652-41-001000 110-11-652-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE yes Active EAR99 GOLD (10) 52 ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e4 Gold (Au) IC SOCKET DIP52
28-3518-11 28-3518-11 Aries Electronics 0.0000
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0.00000000 download 4 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.3 (7.62mm) Row Spacing 3.175mm e4 0.4 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Open Frame 0.3 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 28 (2 x 14) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
100-006-000 100-006-000 3M 0.0000
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0.00000000 download Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2008 100 Obsolete 1 (Unlimited) Solder Gold 6 7.62mm Non-RoHS Compliant Copper Gold 6 4.1mm 10.2mm Through Hole -65°C~125°C DIP, 0.3 (7.62mm) Row Spacing Open Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 8.00μin 0.203μm Flash 6 (2 x 3) Beryllium Copper Brass 0.126 3.20mm 0.100 2.54mm
16-8990-310C 16-8990-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 16 EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 16 (2 x 8) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
28-1508-20 28-1508-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.2 (5.08mm) Row Spacing 9.144mm e3 1.4 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch Closed Frame 0.1 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 28 (2 x 14) Beryllium Copper Brass 0.360 9.14mm 0.100 2.54mm
10-6513-10H 10-6513-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 10 EAR99 Gold 10 ROHS3 Compliant UL94 V-0 3A LOW PROFILE; UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 1 inch 0.7 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 10 (2 x 5) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
40-8750-610C 40-8750-610C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 40 EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 40 (2 x 20) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
121-83-420-41-001101 121-83-420-41-001101 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 121 Active 1 (Unlimited) Wire Wrap Gold 20 ROHS3 Compliant UL94 V-0 1A 20 Through Hole -55°C~125°C 10mOhm 10000000000Ohm DIP, 0.4 (10.16mm) Row Spacing 6.604mm 2.54mm 0.997 inch 0.496 inch RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 1400VAC V Open Frame 0.2 mm UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 20 (2 x 10) Beryllium Copper Brass 0.260 6.60mm 0.100 2.54mm
515-13-142-15-085001 515-13-142-15-085001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 142 ROHS3 Compliant NOT SPECIFIED 1A LOW PROFILE 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.5 inch 1.5 inch STRAIGHT RECTANGULAR 0.122 inch RND PIN-SKT 0.1 inch 1000VAC V Gold (Au) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA142 15X15
124-43-628-41-002000 124-43-628-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC 2012 yes Active Solder EAR99 125°C -55°C Straight 17.7mm 28 35.5mm ROHS3 Compliant Copper Gold 3A DIP SOCKET 150V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 2.54mm 15.24 mm IC SOCKET
116-41-640-41-001000 116-41-640-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
84-PRS11010-12 84-PRS11010-12 Aries Electronics 0.0000
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Min: 1

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0.00000000 5 Weeks Polyphenylene Sulfide (PPS) PRS Active 1 (Unlimited) Solder 84 Gold Non-RoHS Compliant Through Hole PGA, ZIF (ZIP) Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
1105572 1105572 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Vertical 2013 Active 1 (Unlimited) ROHS3 Compliant
44-6554-11 44-6554-11 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 4 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 55 Active 1 (Unlimited) Solder 44 Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm Closed Frame 1A UL94 V-0 0.100 2.54mm Gold 44 (2 x 22) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
510-93-088-13-081002 510-93-088-13-081002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 88 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA88
511-93-196-14-000002 511-93-196-14-000002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 196 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA196
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