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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case Lead Pitch Height Width Mounting Type Operating Temperature Voltage - Rated DC HTS Code Contact Resistance Insulation Resistance Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
44-6554-11 44-6554-11 Aries Electronics 0.0000
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0.00000000 download 4 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 55 Active 1 (Unlimited) Solder 44 Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm Closed Frame 1A UL94 V-0 0.100 2.54mm Gold 44 (2 x 22) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
124-41-310-41-002000 124-41-310-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
16-0503-21 16-0503-21 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA), Nylon, Glass Filled Bulk 2003 0503 Active 1 (Unlimited) Wire Wrap 16 EAR99 Gold 16 ROHS3 Compliant UL94 HB 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 9.144mm 1 RECTANGULAR RND PIN-SKT UL94 HB 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 16 (1 x 16) Beryllium Copper Brass 0.360 9.14mm 0.100 2.54mm
522-93-044-08-031003 522-93-044-08-031003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
511-93-196-14-000002 511-93-196-14-000002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 196 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA196
510-83-175-16-071101 510-83-175-16-071101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 510 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 175 Through Hole -55°C~125°C 10mOhm PGA 3.175mm Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 175 (16 x 16) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
44-3572-16 44-3572-16 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 44 EAR99 Nickel Boron 44 ROHS3 Compliant UL94 V-0 Nickel 1A STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm Closed Frame UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 44 (2 x 22) Beryllium Nickel Beryllium Nickel 0.110 2.78mm 0.100 2.54mm
36-1518-11 36-1518-11 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder EAR99 Gold 36 ROHS3 Compliant UL94 V-0 3A 36 STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.2 (5.08mm) Row Spacing 3.175mm e4 1.8 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Open Frame 0.1 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 36 (2 x 18) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
03-0501-20 03-0501-20 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 3 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1A SIP 2.54mm Through Hole -55°C~105°C SIP 10.668mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 3 (1 x 3) Phosphor Bronze Phosphor Bronze 0.420 10.67mm 0.100 2.54mm
18-1518-10H 18-1518-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 518 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 3A 18 STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.2 (5.08mm) Row Spacing 3.175mm e3 105°C 0.9 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Open Frame 0.1 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 18 (2 x 9) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
48-81250-610C 48-81250-610C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 48 EAR99 Gold 48 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 48 (2 x 24) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
510-13-068-11-061002 510-13-068-11-061002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 68 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA68
APA-308-G-K APA-308-G-K Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole Bulk yes Active Not Applicable EAR99 125°C -55°C Male Straight 10.03mm 8 10.16mm ROHS3 Compliant Brass Gold 1A STANDARD: UL 94V-0 5GOhm e4 Polyester 2 2.54mm 7.62 mm IC SOCKET
18-3513-10H 18-3513-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2015 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 3A 18 LOW PROFILE; UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 2.54mm 1.8 inch 0.4 inch RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.3 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 18 (2 x 9) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
110-11-652-41-001000 110-11-652-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE yes Active EAR99 GOLD (10) 52 ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e4 Gold (Au) IC SOCKET DIP52
28-3518-11 28-3518-11 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 4 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.3 (7.62mm) Row Spacing 3.175mm e4 0.4 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Open Frame 0.3 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 28 (2 x 14) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
100-006-000 100-006-000 3M 0.0000
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0.00000000 download Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2008 100 Obsolete 1 (Unlimited) Solder Gold 6 7.62mm Non-RoHS Compliant Copper Gold 6 4.1mm 10.2mm Through Hole -65°C~125°C DIP, 0.3 (7.62mm) Row Spacing Open Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 8.00μin 0.203μm Flash 6 (2 x 3) Beryllium Copper Brass 0.126 3.20mm 0.100 2.54mm
16-8990-310C 16-8990-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 16 EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 16 (2 x 8) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
28-1508-20 28-1508-20 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.2 (5.08mm) Row Spacing 9.144mm e3 1.4 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch Closed Frame 0.1 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 28 (2 x 14) Beryllium Copper Brass 0.360 9.14mm 0.100 2.54mm
10-6513-10H 10-6513-10H Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 10 EAR99 Gold 10 ROHS3 Compliant UL94 V-0 3A LOW PROFILE; UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 1 inch 0.7 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 10 (2 x 5) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
40-8750-610C 40-8750-610C Aries Electronics 0.0000
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Min: 1

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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 40 EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 40 (2 x 20) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
121-83-420-41-001101 121-83-420-41-001101 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 121 Active 1 (Unlimited) Wire Wrap Gold 20 ROHS3 Compliant UL94 V-0 1A 20 Through Hole -55°C~125°C 10mOhm 10000000000Ohm DIP, 0.4 (10.16mm) Row Spacing 6.604mm 2.54mm 0.997 inch 0.496 inch RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 1400VAC V Open Frame 0.2 mm UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 20 (2 x 10) Beryllium Copper Brass 0.260 6.60mm 0.100 2.54mm
515-13-142-15-085001 515-13-142-15-085001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 142 ROHS3 Compliant NOT SPECIFIED 1A LOW PROFILE 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.5 inch 1.5 inch STRAIGHT RECTANGULAR 0.122 inch RND PIN-SKT 0.1 inch 1000VAC V Gold (Au) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA142 15X15
124-43-628-41-002000 124-43-628-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC 2012 yes Active Solder EAR99 125°C -55°C Straight 17.7mm 28 35.5mm ROHS3 Compliant Copper Gold 3A DIP SOCKET 150V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 2.54mm 15.24 mm IC SOCKET
116-41-640-41-001000 116-41-640-41-001000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
84-PRS11010-12 84-PRS11010-12 Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 5 Weeks Polyphenylene Sulfide (PPS) PRS Active 1 (Unlimited) Solder 84 Gold Non-RoHS Compliant Through Hole PGA, ZIF (ZIP) Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
511-91-181-15-041002 511-91-181-15-041002 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (10) OVER NICKEL (100) 181 Non-RoHS Compliant BERYLLIUM COPPER PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA181
522-93-124-14-071002 522-93-124-14-071002 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

Mult: 1

0.00000000 3 Weeks Active Non-RoHS Compliant
27-0501-20 27-0501-20 Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 27 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1A SIP 2.54mm Through Hole -55°C~105°C SIP 10.668mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 27 (1 x 27) Phosphor Bronze Phosphor Bronze 0.420 10.67mm 0.100 2.54mm
111-93-950-61-001000 111-93-950-61-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
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