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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts ELV Length RoHS Status Flammability Rating Contact Material Contact Plating Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case Lead Pitch Height Width Housing Color Mounting Type Operating Temperature Voltage - Rated DC HTS Code Contact Resistance Insulation Resistance Type Lead Length JESD-609 Code Terminal Pitch Body Length or Diameter Body Breadth Insulation Material Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Plating Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
511-91-181-17-001002 511-91-181-17-001002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (10) OVER NICKEL (100) 181 Non-RoHS Compliant BERYLLIUM COPPER PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA181
ICO-314-SST-L ICO-314-SST-L Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole Polyester, Glass Filled Bulk 2011 ICO yes Active 1 (Unlimited) Solder EAR99 Gold Straight 14 ROHS3 Compliant UL94 V-0 1A No STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 2 Open Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
A-CCS 068-G-T A-CCS 068-G-T Assmann WSW Components 0.0000
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0.00000000 23 Weeks Polybutylene Terephthalate (PBT) Tube 2015 Active 1 (Unlimited) Solder Gold 68 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole -40°C~105°C 15mOhm PLCC e3 Closed Frame 1A UL94 V-0 0.050 1.27mm 68 (4 x 17) Phosphor Bronze Phosphor Bronze 0.132 3.35mm 0.100 2.54mm
24-3553-11 24-3553-11 Aries Electronics 0.0000
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0.00000000 download 4 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing e4 Closed Frame 1A UL94 V-0 0.100 2.54mm 24 (2 x 12) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
06-6513-11 06-6513-11 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 6 EAR99 Gold 6 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.175mm e4 0.7 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch Closed Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 6 (2 x 3) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
SIP1X32-011BLF SIP1X32-011BLF Amphenol ICC (FCI) 0.0000
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0.00000000 Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2006 SIP1x Obsolete 1 (Unlimited) Solder EAR99 Gold 32 83.8mm RoHS Compliant UL94 V-0 Copper 32 STANDARD: UL 94V-0 4.19mm 2.54mm Through Hole 8536.69.40.40 SIP 3.175mm e4 Closed Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 32 (1 x 32) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
116-83-304-41-001101 116-83-304-41-001101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 4 ROHS3 Compliant UL94 V-0 1A 4 Through Hole -55°C~125°C 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 4 (2 x 2) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
336-PLS20019-12 336-PLS20019-12 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS) Bulk 2006 PLS Active 1 (Unlimited) Solder 336 125°C -65°C Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole -65°C~125°C PGA, ZIF (ZIP) 3.175mm Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
13-0501-21 13-0501-21 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 13 125°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 1A SIP 2.54mm Through Hole -55°C~125°C SIP 10.668mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm 13 (1 x 13) Phosphor Bronze Phosphor Bronze 0.420 10.67mm 0.100 2.54mm
16-8510-310C 16-8510-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 16 EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 16 (2 x 8) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
1554116-3 1554116-3 TE Connectivity AMP Connectors 0.0000
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0.00000000 download 15 Weeks Solder, Surface Mount Thermoplastic Tray 2013 Obsolete 1 (Unlimited) Solder 1356 Gold Compliant RoHS Compliant UL94 V-0 Gold LGA Black Surface Mount -25°C~100°C LGA Open Frame Gold UL94 V-0 0.040 1.02mm Gold 30.0μin 0.76μm 30.0μin 0.76μm 1356 (32 x 41) Copper Alloy Copper Alloy 0.040 1.01mm
44-3554-16 44-3554-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2007 55 yes Active 1 (Unlimited) Solder 44 EAR99 Nickel Boron 44 ROHS3 Compliant UL94 V-0 Nickel 1A STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm Closed Frame UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 44 (2 x 22) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
124-93-964-41-002000 124-93-964-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Wire Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 124 no Active 1 (Unlimited) Wire Wrap EAR99 Gold Straight 25.3mm 64 81.2mm Non-RoHS Compliant Copper 3A 64 DIP SOCKET 25.4mm Through Hole -55°C~125°C 150V 8536.90.40.00 10mOhm 10GOhm DIP, 0.9 (22.86mm) Row Spacing e0 Polychlorinated 2 Open Frame 22.86 mm 0.100 2.54mm Tin-Lead 30.0μin 0.76μm 200.0μin 5.08μm 64 (2 x 32) Beryllium Copper Brass Alloy 0.630 16.00mm 0.100 2.54mm
APA-648-G-B APA-648-G-B Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole Bulk yes Active Not Applicable EAR99 Male Straight 48 ROHS3 Compliant BRASS No 8536.69.40.40 e4 2 Gold (Au) - with Nickel (Ni) barrier 2.54mm IC SOCKET
EDO-32PLCZSM EDO-32PLCZSM ON Shore Technology 0.0000
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0.00000000 download 8 Weeks Polyphenylene Sulfide (PPS) Tube ED Active 1 (Unlimited) Solder SN ON NI 32 ROHS3 Compliant Surface Mount -55°C~105°C 30mOhm 5000000000Ohm PLCC 0.765 inch 0.665 inch 0.181 inch 600VAC V Closed Frame 1A UL94 V-0 0.050 1.27mm 32 (2 x 16) Phosphor Bronze Phosphor Bronze 0.050 1.27mm 9X7
116-41-432-41-008000 116-41-432-41-008000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
511-93-125-13-041002 511-93-125-13-041002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 125 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA125
D01-9973042 D01-9973042 Harwin Inc. 0.0000
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0.00000000 download 17 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Tube 2013 D01-997 yes Active 1 (Unlimited) Solder EAR99 Gold 30 ROHS3 Compliant UL94 V-0 1A 30 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm SIP 3.175mm e3 UL94 V-0 0.100 2.54mm Tin Flash 196.9μin 5.00μm 30 (1 x 30) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
110-11-316-41-001000 110-11-316-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE yes Active 1 (Unlimited) EAR99 GOLD (10) 16 ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e4 Gold (Au) IC SOCKET DIP16
116-43-210-61-007000 116-43-210-61-007000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
108-PRS13129-12 108-PRS13129-12 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS) Bulk 2016 PRS Active 1 (Unlimited) Solder 125°C -65°C Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole -65°C~125°C PGA, ZIF (ZIP) 3.175mm Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
36-1518-10T 36-1518-10T Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 Gold 3A 36 Through Hole DIP, 0.2 (5.08mm) Row Spacing 3.175mm 2 Open Frame 2.54mm 3A UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 36 (2 x 18) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
APA-422-G-A APA-422-G-A Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole POLYESTER Bulk yes Active Not Applicable EAR99 Male Straight 22 ROHS3 Compliant BRASS No STANDARD: UL 94V-0 8536.69.40.40 e4 2 Gold (Au) - with Nickel (Ni) barrier 2.54mm IC SOCKET
AR 32 HZL-TT AR 32 HZL-TT Assmann WSW Components 0.0000
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0.00000000 23 Weeks Polybutylene Terephthalate (PBT), Glass Filled Tube Active 1 (Unlimited) Solder EAR99 Tin 32 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole -40°C~105°C 8536.69.40.40 4mOhm 1000000000Ohm DIP, 0.6 (15.24mm) Row Spacing e3 2.54mm 1.6 inch 0.7 inch RECTANGULAR 0.178 inch MACHINE SCREW 0.1 inch Open Frame 3A 0.6 mm UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 32 (2 x 16) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
511-93-281-19-081002 511-93-281-19-081002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
146-41-308-41-012000 146-41-308-41-012000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
40-3574-10 40-3574-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 40 EAR99 Gold 40 ROHS3 Compliant UL94 V-0 Gold, Tin 1A STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm e3 Closed Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 40 (2 x 20) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
22-0518-10H 22-0518-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder EAR99 Gold 22 ROHS3 Compliant UL94 V-0 3A 22 STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e3 2.2 inch 1 RECTANGULAR RND PIN-SKT Open Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 22 (1 x 22) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
24-8370-610C 24-8370-610C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 24 (2 x 12) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
511-91-132-14-071002 511-91-132-14-071002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
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