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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Lifecycle Status Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case Reach Compliance Code Lead Pitch Height Width Housing Color Mounting Type Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Max Current Rating Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Circuit Application Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Max Voltage Rating (AC) Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
523-93-256-16-000003 523-93-256-16-000003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 256 Non-RoHS Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.6 inch 1.6 inch STRAIGHT RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier WIRE WRAP 0.1 mm IC SOCKET PGA256 16X16
515-91-114-13-062003 515-91-114-13-062003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
22-4820-90C 22-4820-90C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Horizontal, Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Vertisockets™ 800 Active 1 (Unlimited) Solder 22 EAR99 Gold 22 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole, Right Angle, Horizontal -55°C~105°C DIP, 0.4 (10.16mm) Row Spacing 3.556mm e4 Closed Frame UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 22 (2 x 11) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
02-1508-31 02-1508-31 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 2 ROHS3 Compliant UL94 V-0 3A 2 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C DIP, 0.2 (5.08mm) Row Spacing 12.7mm 0.1 inch RECTANGULAR 0.193 inch RND PIN-SKT 0.1 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 2 (1 x 2) Beryllium Copper Brass 0.500 12.70mm
34-1508-31 34-1508-31 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 34 ROHS3 Compliant UL94 V-0 3A 34 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C DIP, 0.2 (5.08mm) Row Spacing 12.7mm e4 1.7 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch Closed Frame 0.1 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 34 (2 x 17) Beryllium Copper Brass 0.500 12.70mm 0.100 2.54mm
551-10-109-12-051005 551-10-109-12-051005 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (10) OVER NICKEL (150) 109 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) - with Nickel (Ni) barrier IC SOCKET PGA109
146-83-648-41-035101 146-83-648-41-035101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 146 Active 1 (Unlimited) Press-Fit Gold ROHS3 Compliant UL94 V-0 1A 48 Through Hole -55°C~125°C 10mOhm DIP, 0.6 (15.24mm) Row Spacing 3.81mm Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 48 (2 x 24) Beryllium Copper Brass 0.150 3.81mm 0.100 2.54mm
546-83-068-11-061135 546-83-068-11-061135 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 546 yes Active 1 (Unlimited) Press-Fit Gold ROHS3 Compliant UL94 V-0 1A 68 Through Hole -55°C~125°C 10mOhm PGA 2.4892mm Open Frame UL94 V-0 0.050 1.27mm Tin 29.5μin 0.75μm 68 (11 x 11) Beryllium Copper Bronze 0.098 2.50mm 0.100 2.54mm
116-43-318-61-007000 116-43-318-61-007000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
515-93-089-13-082001 515-93-089-13-082001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 89 Non-RoHS Compliant NOT SPECIFIED LOW PROFILE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA89
48-6501-21 48-6501-21 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2013 501 Active 1 (Unlimited) Wire Wrap 125°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 1.5A 48 Through Hole -55°C~125°C DIP, 0.6 (15.24mm) Row Spacing 10.414mm Closed Frame 1.5A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm 48 (2 x 24) Phosphor Bronze Phosphor Bronze 0.410 10.41mm 0.100 2.54mm
20-822-90 20-822-90 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Horizontal, Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2013 Vertisockets™ 800 Active 1 (Unlimited) Solder 20 EAR99 Gold 20 ROHS3 Compliant UL94 V-0 1.5A STANDARD: UL 94V-0 Through Hole, Right Angle, Horizontal -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.683mm e4 2.54mm 1.05 inch 0.4 inch RECTANGULAR 0.58 inch SQ PIN-SKT 0.1 inch Closed Frame 0.2 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 20 (2 x 10) Phosphor Bronze Phosphor Bronze 0.145 3.68mm 0.100 2.54mm
BU400Z-178-HT BU400Z-178-HT On Shore Technology Inc. 0.0000
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0.00000000 download 8 Weeks Surface Mount Polybutylene Terephthalate (PBT), Glass Filled Tube BU-178HT Active 1 (Unlimited) Solder Gold 40 50.8mm ROHS3 Compliant UL94 V-0 Contains Lead 1A 40 4.3mm 17.7mm Surface Mount -55°C~125°C 7mOhm 1000000000000Ohm DIP, 0.6 (15.24mm) Row Spacing 1.524mm 2.54mm 0.697 inch RECTANGULAR 0.146 inch RND PIN-SKT 0.1 inch Open Frame 0.6 mm UL94 V-0 0.100 2.54mm Copper 78.7μin 2.00μm Flash 40 (2 x 20) Beryllium Copper Brass 0.059 1.50mm 0.100 2.54mm
20-0503-30 20-0503-30 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA), Nylon, Glass Filled Bulk 2003 0503 Active 1 (Unlimited) Wire Wrap 20 EAR99 Gold 20 ROHS3 Compliant UL94 HB 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 12.7mm 2 inch 1 RECTANGULAR RND PIN-SKT UL94 HB 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 20 (1 x 20) Beryllium Copper Brass 0.500 12.70mm 0.100 2.54mm
30-8563-610C 30-8563-610C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 30 EAR99 Gold 30 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 30 (2 x 15) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
39-0511-10 39-0511-10 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 511 Active 1 (Unlimited) Solder 39 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1A SIP 2.54mm Through Hole -55°C~105°C SIP 3.81mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Tin 50.0μin 1.27μm 50.0μin 1.27μm 39 (1 x 39) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
123-41-304-41-001000 123-41-304-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks yes Active EAR99 GOLD (10) OVER NICKEL (100) ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e3 Matte Tin (Sn) - with Nickel (Ni) barrier IC SOCKET
48-6554-16 48-6554-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 55 yes Active 1 (Unlimited) Solder 48 EAR99 Nickel Boron 48 ROHS3 Compliant UL94 V-0 Nickel 1A STANDARD: UL 94V-0 Through Hole 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm 2.54mm 200°C 2.99 inch 0.9 inch RECTANGULAR 0.47 inch BELLOWED TYPE 0.1 inch 1000VAC V Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 48 (2 x 24) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
126-43-322-41-002000 126-43-322-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC 2006 yes Active EAR99 125°C -55°C Straight 10.1mm 22 27.8mm ROHS3 Compliant NOT SPECIFIED Gold 3A DIP SOCKET 150V 100V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 Matte Tin (Sn) - with Nickel (Ni) barrier 2.54mm 7.62 mm IC SOCKET
614-83-318-31-012101 614-83-318-31-012101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 614 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 1A 18 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.4544mm e3 Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 18 (2 x 9) Beryllium Copper Brass 0.136 3.45mm 0.100 2.54mm
100-028-051 100-028-051 3M 0.0000
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0.00000000 download Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2008 100 Obsolete 1 (Unlimited) Solder Gold RoHS Compliant Gold 28 Through Hole -65°C~125°C DIP, 0.6 (15.24mm) Row Spacing Closed Frame, Seal Tape 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 8.00μin 0.203μm Flash 28 (2 x 14) Beryllium Copper Brass 0.126 3.20mm 0.100 2.54mm
2-2129710-7 2-2129710-7 TE Connectivity AMP Connectors 29.6903
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0.00000000 download 7 Weeks ACTIVE (Last Updated: 3 days ago) Solder, Surface Mount Thermoplastic Tray 2016 Active Not Applicable Solder Gold 1824 RoHS Compliant UL94 V-0 500mA Black Surface Mount LGA Open Frame Signal 0.5A UL94 V-0 30.0μin 0.76μm 3647 Copper Alloy Copper Alloy
123-41-432-41-001000 123-41-432-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks yes Active EAR99 GOLD (10) OVER NICKEL (100) ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e3 Matte Tin (Sn) - with Nickel (Ni) barrier IC SOCKET
117-43-668-61-105000 117-43-668-61-105000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
104-13-632-41-770000 104-13-632-41-770000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Thermoplastic Tube 2012 104 yes Active 1 (Unlimited) Press-Fit EAR99 125°C -55°C Gold Straight 17.7mm 32 40.6mm ROHS3 Compliant Copper 3A 32 DIP SOCKET 17.8mm Through Hole 150V 100V 8536.90.40.00 10mOhm 10GOhm DIP, 0.6 (15.24mm) Row Spacing e4 Polychlorinated 2 Open Frame 15.24 mm 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 32 (2 x 16) Beryllium Copper Brass Alloy 0.175 4.45mm 0.100 2.54mm
551-90-125-14-071004 551-90-125-14-071004 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 TIN LEAD (200) OVER NICKEL (150) 125 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET PGA125
116-87-328-41-004101 116-87-328-41-004101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 1A 28 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin Flash 28 (2 x 14) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
XR2D-4001-N XR2D-4001-N Omron Electronics Inc-EMC Div 0.0000
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0.00000000 download Through Hole Polybutylene Terephthalate (PBT), Glass Filled Bulk 2002 XR2 Obsolete 1 (Unlimited) Solder EAR99 Gold Straight 40 RoHS Compliant unknown Through Hole -55°C~125°C 20mOhm 1A DIP, 0.6 (15.24mm) Row Spacing e4 Carrier UL94 V-0 300V 0.100 2.54mm 29.5μin 0.75μm 29.5μin 0.75μm 40 (2 x 20) Beryllium Copper Beryllium Copper 0.100 2.54mm
110-88-640-41-530000 110-88-640-41-530000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 PLASTIC 2010 no Active EAR99 TIN LEAD (100) 40 Non-RoHS Compliant NOT SPECIFIED STANDARD: MIL-S-83734, STACKABLE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET DIP40
40-1518-10 40-1518-10 Aries Electronics 4.5847
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder 40 EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.2 (5.08mm) Row Spacing 3.175mm e3 105°C 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Open Frame 0.1 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 40 (2 x 20) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
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