Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Voltage | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
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.png "THGBMHG7C2LBAIL") |
THGBMHG7C2LBAIL | Kioxia America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Surface Mount | 153-WFBGA (11.5x13) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT34C02-10PI-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | Not Applicable | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | EEPROM | AT34C02 | 8-PDIP | 900ns | 2Kb 256 x 8 | Non-Volatile | 2.7V~5.5V | 400kHz | EEPROM | I2C | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70P265L65BYGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2011 | yes | Discontinued | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | 6mm | RoHS Compliant | Lead Free | No | 100 | TFBGA | Parallel | 3V | 1.8V | 256 kb | 6mm | 1mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 65 ns | 32kB | RAM, SDR, SRAM | 28b | 0.07mA | 16KX16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AK93C55BH | AKM Semiconductor Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | Obsolete | 1 (Unlimited) | Surface Mount | -40°C~85°C TA | EEPROM | 8-MSOP | 2Kb 128 x 16 | Non-Volatile | 1.8V~5.5V | EEPROM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7519S133BC8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | BGA | Parallel | 3.45V | 3.15V | 9 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 645mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 18b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28HC256-90PU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2016 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 28-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | AT28HC256 | 90ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS21ES04G-JCLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 153 | 13mm | ROHS3 Compliant | 153-VFBGA | 11.5mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (MLC) | SYNCHRONOUS | 1mm | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.5mm | R-PBGA-B153 | 2.7V | 3.6V | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | 4GX8 | 8 | 34359738368 bit | PARALLEL | 200MHz | 3.3V | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M29F400FB55M3F2 TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2014 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 44-SOIC (0.496, 12.60mm Width) | Surface Mount | -40°C~125°C TA | FLASH - NOR | M29F400 | 4Mb 512K x 8 256K x 16 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL064N11FFIV13 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | Tape & Reel (TR) | 1997 | GL-N | Active | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | 64 | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | YES | 1mm | 2.7V | Not Qualified | 1.8/3.33/3.3V | 3.6V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 0.05mA | 1.65V~3.6V | 4MX16 | 16 | 0.000005A | 110 ns | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 110ns | 64K | BOTTOM/TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S34MS01G200TFB000 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 48 | 18.4mm | RoHS Compliant | 12mm | CMOS | ASYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | NOT SPECIFIED | 1.8V | NOT SPECIFIED | INDUSTRIAL | YES | 0.5mm | R-PDSO-G48 | 1.7V | 105°C | -40°C | 1.95V | AEC-Q100 | 128MX8 | 8 | 1073741824 bit | FLASH | PARALLEL | 1.8V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC32GJVED-3M WT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2013 | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 169-VFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | MTFC32G | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43DR16640B-25DBLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 84 | EAR99 | 1.8V | 1 | 12.5mm | ROHS3 Compliant | No | 84 | AUTO/SELF REFRESH | 84-TFBGA | No SVHC | 1 Gb | 1.2mm | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | 8542.32.00.32 | 1 | 240mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 1.8V | 0.8mm | 1.7V | 1.9V | 85°C | 3-STATE | 400ps | 1Gb 64M x 16 | Volatile | 16b | 1.7V~1.9V | 64MX16 | 16 | 16b | 400MHz | 0.015A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62C256AL-45TLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | yes | Active | 3 (168 Hours) | 28 | EAR99 | 5V | 1 | 8.1mm | ROHS3 Compliant | Lead Free | No | 28 | 28-TSSOP (0.465, 11.80mm Width) | 256 kb | 1mm | 11.9mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 25mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 28 | YES | 0.55mm | 5V | 3-STATE | 256Kb 32K x 8 | Volatile | 15b | 4.5V~5.5V | 32KX8 | Asynchronous | 0.00002A | 45 ns | 8b | COMMON | 2V | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16160G-7BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 54 | AUTO/SELF REFRESH | 54-TFBGA | No SVHC | 256 Mb | Surface Mount | -40°C~85°C TA | SDRAM | 1.2mm | 1 | 130mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 10 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 256Mb 16M x 16 | Volatile | 15b | 3V~3.6V | 16MX16 | 16 | 16b | 143MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61LV2568L-10TL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Active | 2 (1 Year) | 44 | 3.3V | 1 | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 2 Mb | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 1 | 60mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3.3V | 40 | 44 | YES | 0.8mm | 2.97V | 3.63V | 3-STATE | 2Mb 256K x 8 | Volatile | 18b | 3.135V~3.6V | 256KX8 | 8 | Asynchronous | 0.003A | 8b | COMMON | 3V | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16400J-7TLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 22.22mm | ROHS3 Compliant | No | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 64 Mb | Surface Mount | -40°C~85°C TA | SDRAM | 1.2mm | 1 | 90mA | e3 | MATTE TIN | DUAL | 260 | 3.3V | 10 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 64Mb 4M x 16 | Volatile | 14b | 3V~3.6V | 4MX16 | 16 | 16b | 143MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
RMLV0416EGBG-4S2#AC0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tray | 2013 | yes | Active | 3 (168 Hours) | 48 | ROHS3 Compliant | 48-TFBGA | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | BOTTOM | 3V | RMLV0416 | 48 | YES | 0.75mm | R-PBGA-B48 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 3-STATE | 4Mb 256K x 16 | Volatile | 0.025mA | 2.7V~3.6V | 256KX16 | 16 | 4194304 bit | 0.000002A | 45 ns | COMMON | 1.5V | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S34MS02G100BHB003 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | 63 | 11mm | RoHS Compliant | 9mm | CMOS | ASYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | INDUSTRIAL | YES | 0.8mm | R-PBGA-B63 | 1.7V | 105°C | -40°C | 1.95V | AEC-Q100 | 256MX8 | 8 | 2147483648 bit | FLASH | PARALLEL | 1.8V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
JS28F00AP30BFA | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2004 | Axcell™ | Obsolete | 3 (168 Hours) | 56 | 1.8V | 18.4mm | ROHS3 Compliant | Gold, Tin | No | 56 | BOTTOM BOOT | 56-TFSOP (0.724, 18.40mm Width) | Parallel, Serial | 1 Gb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 1 | 31mA | e3 | Matte Tin (Sn) | DUAL | 260 | 1.8V | 30 | 28F00AP30 | YES | 0.5mm | 1.81.8/3.3V | 1.7V | 1Gb 64M x 16 | Non-Volatile | 26b | 1.7V~2V | 64MX16 | 16 | Asynchronous | 40MHz | 0.00024A | 110 ns | 16b | NO | NO | 41023 | 16words | FLASH | Parallel | 110ns | 16K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32800B-6BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 2 (1 Year) | 90 | EAR99 | 1 | 13mm | Non-RoHS Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | not_compliant | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.45mm | 8542.32.00.24 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 90 | YES | 0.8mm | 3V | Not Qualified | 3.3V | 3.6V | 5.5ns | 256Mb 8M x 32 | Volatile | 0.3mA | 3V~3.6V | 8MX32 | 32 | 268435456 bit | 32b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AT24C256-10UI-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 1 (Unlimited) | 85°C | -40°C | Non-RoHS Compliant | Contains Lead | 8 | 8-VFBGA | 2-Wire, I2C, Serial | 5.5V | 2.7V | 1MHz | Surface Mount | -40°C~85°C TA | EEPROM | 400kHz | AT24C256 | 8-dBGA (3.81x2.34) | 550ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~5.5V | 1MHz | EEPROM | I2C | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V25L35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2008 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 3.3V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 128 kb | 29.21mm | 3.63mm | CMOS | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 3-STATE | 35 ns | RAM, SRAM | 26b | 8KX16 | Asynchronous | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX29GL128ELXFI-90G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | 2009 | MX29GL | Not For New Designs | 3 (168 Hours) | 64 | 3A991.B.1.A | 3.6V | 13mm | ROHS3 Compliant | Lead Free | 64-LBGA, CSPBGA | unknown | 128 Mb | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | 64 | YES | 1mm | R-PBGA-B64 | 2.7V | Not Qualified | 3/3.3V | 128Mb 16M x 8 | Non-Volatile | 0.1mA | 2.7V~3.6V | 128MX16 | 16 | 0.0001A | 90 ns | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 90ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST25VF080B-80-4C-SAE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2010 | SST25 | Obsolete | 2 (1 Year) | 8 | 3A991.B.1.A | 3.3V | 4.9mm | ROHS3 Compliant | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 8 Mb | Surface Mount | 540.001716mg | 0°C~70°C TA | CMOS | 25mA | 1.75mm | 1 | 20mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 40 | SST25VF080B | 8 | YES | 1.27mm | 2.7V | 3.6V | 6 ns | 8Mb 1M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 80MHz | 0.00002A | 8b | 100 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 10μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49BV160D-70TU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 1997 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT49BV160 | 70ns | 16Mb 1M x 16 | Non-Volatile | 2.65V~3.6V | FLASH | Parallel | 120μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256SA15PZGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 5V | 1 | 8mm | RoHS Compliant | Lead Free | No | 28 | TSOP | Parallel | 5.5V | 4.5V | 256 kb | 11.8mm | 1mm | CMOS | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 30 | 28 | INDUSTRIAL | 0.55mm | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R1LP0408DSP-5SI#B0 | Renesas Electronics America | 8.8629 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Surface Mount | Tube | 2012 | yes | Last Time Buy | 3 (168 Hours) | 32 | 5V | 1 | 20.95mm | ROHS3 Compliant | Lead Free | No | 32 | 32-SOIC (0.450, 11.40mm Width) | 4 Mb | 2.75mm | 11.5mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 25mA | DUAL | 5V | R1LP0408 | 32 | 5V | 3-STATE | 4Mb 512K x 8 | Volatile | 19b | 4.5V~5.5V | Asynchronous | 55 ns | 8b | COMMON | 2V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416S12PHGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT71V416 | 44-TSOP II | 12ns | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 12ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT49H8M36BM-25:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Bulk | Obsolete | 3 (168 Hours) | 144 | 1.8V | 1 | 18.5mm | ROHS3 Compliant | Lead Free | No | 144 | AUTO REFRESH | 144-TFBGA | 288 Mb | Surface Mount | 0°C~95°C TC | CMOS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT49H8M36 | 1mm | 1.7V | 1.5/1.81.82.5V | 1.9V | 3-STATE | 20ns | 288Mb 8M x 36 | Volatile | 22b | 0.7mA | 1.7V~1.9V | 8MX36 | 36 | 36b | 400MHz | COMMON | DRAM | Parallel | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42S32160F-6BL | ISSI, Integrated Silicon Solution Inc | 4.6027 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tube | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 90-TFBGA | 8mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | BOTTOM | 3.3V | YES | 0.8mm | R-PBGA-B90 | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | 512Mb 16M x 32 | Volatile | 0.245mA | 3V~3.6V | 16MX32 | 32 | 536870912 bit | 167MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 |
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