Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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BR24A64F-WLBH2 | ROHM Semiconductor | 4.2512 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | ALSO AVAILABLE IN 100KHZ AND SEATED HT-CALCULATED | 8-SOIC (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -40°C~105°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.5V | 5.5V | 64Kb 8K x 8 | Non-Volatile | 2.5V~5.5V | 8KX8 | 8 | 65536 bit | SERIAL | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST39VF512-70-4C-NHE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2000 | SST39 MPF™ | Obsolete | 3 (168 Hours) | 32 | 3.3V | ROHS3 Compliant | No | 32 | 32-LCC (J-Lead) | 512 kb | Surface Mount | 0°C~70°C TA | CMOS | QUAD | SST39VF512 | 1.27mm | 70ns | 512Kb 64K x 8 | Non-Volatile | 0.02mA | 2.7V~3.6V | 64KX8 | 8 | 8b | 0.000015A | 8b | YES | YES | YES | 16 | FLASH | Parallel | 20μs | 4K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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23A512T-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 1, (3 LINE) | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 40 | 23A512 | YES | 1.27mm | R-PDSO-G8 | 1.7V | Not Qualified | 1.8/2V | 2.2V | TS 16949 | 512Kb 64K x 8 | Volatile | 0.01mA | 1.7V~2.2V | 64KX8 | 8 | 524288 bit | 20MHz | 0.000004A | SEPARATE | 1.7V | SRAM | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT29F1G08ABAEAH4-IT:E") |
MT29F1G08ABAEAH4-IT:E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Surface Mount | Bulk | 2009 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 3.3V | ROHS3 Compliant | Copper, Silver, Tin | 63 | 63-VFBGA | Parallel | 3.6V | 2.7V | 1 Gb | Surface Mount | -40°C~85°C TA | FLASH - NAND | 35mA | MT29F1G08 | 63-VFBGA (9x11) | 1Gb 128M x 8 | Non-Volatile | 28b | 2.7V~3.6V | Asynchronous | 8b | 2kB | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT49LD3200-13TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 86-TFSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TC | FLASH | AT49LD3200 | 86-TSOP II | 170ns | 32Mb 1M x 32 2M x 16 | Non-Volatile | 3V~3.6V | 75MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA01HT-I/OT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | Active | 1 (Unlimited) | 5 | EAR99 | 5V | 2.9mm | ROHS3 Compliant | Tin | No | 5 | SC-74A, SOT-753 | 2-Wire, I2C, Serial | 1 kb | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 24AA01H | 5 | 1.7V | 900ns | 1Kb 128 x 8 | Non-Volatile | 1.7V~5.5V | 128X8 | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | I2C | 1010XXXR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT52L256M64D2GN-107 WT ES:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 256-WFBGA | Surface Mount | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | 256-FBGA (14x14) | 16Gb 256M x 64 | Volatile | 1.2V | 933MHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA02E64T-E/OT | Microchip Technology | 0.2986 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | Active | 1 (Unlimited) | 5 | 2.9mm | ROHS3 Compliant | Tin | 5 | 100KHZ AVAILABLE @1.7V | SC-74A, SOT-753 | 2-Wire, I2C, Serial | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1 | e3 | DUAL | 5V | 24AA02E64 | Not Qualified | 900ns | TS 16949 | 2Kb 256 x 8 | Non-Volatile | 0.003mA | 1.7V~5.5V | 8 | 2048 bit | 400kHz | 200 | 1000000 Write/Erase Cycles | I2C | 1010XXXR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C2565KV18-500BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II+ | 165-FBGA (13x15) | 72Mb 2M x 36 | Volatile | 1.7V~1.9V | 500MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT53B512M64D4NZ-062 WT ES:D TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | -30°C~85°C TC | SDRAM - Mobile LPDDR4 | 32Gb 512M x 64 | Volatile | 1.1V | 1600MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TH58NVG3S0HTAI0 | Kioxia America, Inc. | 9.7581 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 3 (168 Hours) | 48 | 18.4mm | RoHS Compliant | 48-TFSOP (0.724, 18.40mm Width) | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1.2mm | 1 | DUAL | 3.3V | YES | 0.5mm | R-PDSO-G48 | 2.7V | 3.6V | 8Gb 1G x 8 | Non-Volatile | 2.7V~3.6V | 1GX8 | 8 | 8589934592 bit | 3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PF38F3050M0Y0CEB TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | PF38F3050M0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT27C080-12DC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-CDIP (0.600, 15.24mm) | Through Hole | 0°C~70°C TC | EPROM - UV | AT27C080 | 32-CDIP | 120ns | 8Mb 1M x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1292DV18-167BZC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | 1.8V | 15mm | Non-RoHS Compliant | Contains Lead | 165 | PIPELINED ARCHITECTURE | 165-LBGA | not_compliant | 9 Mb | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | BOTTOM | 220 | 1.8V | NOT SPECIFIED | CY7C1292 | 165 | YES | 1mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 50 ns | 9Mb 512K x 18 | Volatile | 0.5mA | 1.7V~1.9V | 512KX18 | 18 | 167MHz | 0.24A | SEPARATE | 1.7V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MSM5117400F-60T3DR1 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 2 (1 Year) | ROHS3 Compliant | 0°C~70°C TA | DRAM | 30ns | 16Mb 4M x 4 | Volatile | 4.5V~5.5V | DRAM | Parallel | 110ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
N25Q032A13E1240F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | N25Q032 | 32Mb 8M x 4 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI | 8ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3557S80BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 95MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 8 ns | RAM, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71256SA20YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | 2011 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 5.5V | 4.5V | 256 kb | 7.6mm | 2.67mm | CMOS | 3.556mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | YES | SRAMs | 5V | 3-STATE | 20 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CG7858AA | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M93C46-WMN6TP | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | Surface Mount | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | No SVHC | 1 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SO8N-SO-A | 1 | 2mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 5V | 30 | M93C46 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 85°C | 400 ns | 1Kb 128 x 8 64 x 16 | Non-Volatile | 2.5V~5.5V | 64X16 | SERIAL | 2MHz | 0.00001A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H64M32LFCX-6 WT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2013 | Obsolete | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-VFBGA | 9mm | Surface Mount | -25°C~85°C TA | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | 8542.32.00.36 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 1.8V | MT46H64M32 | 90 | YES | 0.8mm | R-PBGA-B90 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5ns | 2Gb 64M x 32 | Volatile | 0.14mA | 1.7V~1.95V | 64MX32 | 32 | 2147483648 bit | 166MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 15ns | 24816 | 24816 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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23LC512T-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 1, (3 LINE) | 4.9mm | ROHS3 Compliant | Lead Free | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 23LC512 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/5V | 5.5V | TS 16949 | 512Kb 64K x 8 | Volatile | 0.01mA | 2.5V~5.5V | 64KX8 | 8 | 524288 bit | 20MHz | 0.000004A | SEPARATE | 2.5V | SRAM | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V321L25JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 52 | EAR99 | 85°C | -40°C | 3.3V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 3.6V | 3V | 16 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 130mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 52 | INDUSTRIAL | SRAMs | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.004A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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11AA02UIDT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 2 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | 5mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 11AA02UID | YES | 1.27mm | 5.5V | TS 16949 | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 100kHz | 5ms | SPI | EEPROM | Single Wire | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CG8282AA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tray | Obsolete | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25AA640AX-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 64 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | DUAL | 260 | 2.5V | 40 | 25AA640A | 8 | YES | 0.65mm | 160 ns | 64Kb 8K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL128P0XMFI011M | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | 2015 | FL-P | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16-SOIC | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI | 3μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71T75602S200PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 200MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 2.5V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 512KX36 | 36 | 18874368 bit | 3.2 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX29LV400CTTC-90G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | 2012 | MX29LV | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 18.4mm | RoHS Compliant | 48-TFSOP (0.724, 18.40mm Width) | 12mm | Surface Mount | 0°C~70°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 48 | YES | 0.5mm | R-PDSO-G48 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 4Mb 512K x 8 | Non-Volatile | 0.03mA | 2.7V~3.6V | 4MX16 | 16 | 67108864 bit | 0.000005A | 90 ns | 8 | 3V | YES | YES | YES | 1217 | YES | YES | FLASH | Parallel | 90ns | 16K8K32K64K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||
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25AA640A-I/W16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | -40°C~85°C TA | EEPROM | 25AA640A | Die | 64Kb 8K x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | EEPROM | SPI | 5ms |
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SST39VF512-70-4C-NHE-T Microchip Technology
Surface Mount SST39 MPF™ Memory IC SST39 MPF™ Series SST39VF512 512 kb kb 8b b
Price: 0.0000
RFQ -
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MT29F1G08ABAEAH4-IT:E Micron Technology Inc.
Surface Mount Memory IC MT29F1G08 1 Gb kb 35mA mA 8b b
Price: 0.0000
RFQ -
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24AA01HT-I/OT Microchip Technology
Surface Mount 5 Pin Memory IC 24AA01H 1 kb kb 2.9mm mm 3mA mA
Price: 0.0000
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CY7C1292DV18-167BZC Cypress Semiconductor Corp
165 Pin Memory IC CY7C1292 9 Mb kb 15mm mm
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25AA640AX-I/ST Microchip Technology
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