Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Voltage - Rated DC | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Logic Function | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Time Format | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Number of Timers | Reverse Pinout | Refresh Cycles | Self Refresh | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
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BR24G256-3 | ROHM Semiconductor | 5.4798 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | Obsolete | 1 (Unlimited) | 8 | ROHS3 Compliant | 2 | SEATED HT-CALCULATED | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 3.7mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | NO | R-PDIP-T8 | 1.6V | Not Qualified | 1.8/5V | 5.5V | 256Kb 32K x 8 | Non-Volatile | 1.6V~5.5V | 8 | 400kHz | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT53E2DCDS-DC TR") |
MT53E2DCDS-DC TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS61LF204818A-7.5TQLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 85°C | -40°C | 3.3V | 2 | RoHS Compliant | No | 100 | 100-LQFP | Parallel | 3.465V | 3.135V | 36 Mb | 117MHz | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 350mA | 117MHz | 100-TQFP (14x20) | 7.5ns | 36Mb 2M x 18 | Volatile | 21b | 3.135V~3.465V | Synchronous | 117MHz | 18b | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39WF800B-70-4I-B3KE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | 2000 | SST39 MPF™ | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 1.8V | 8mm | ROHS3 Compliant | Lead Free | No | 48 | 48-TFBGA | 8 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 8542.32.00.51 | 1 | 15mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 40 | SST39WF800B | 48 | YES | 0.8mm | 1.65V | 1.95V | 70ns | 8Mb 512K x 16 | Non-Volatile | 19b | 1.65V~1.95V | 512KX16 | 16 | Asynchronous | 16b | 0.00004A | 16b | YES | YES | YES | 256 | YES | FLASH | Parallel | 40μs | 2K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70914S12PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 80-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70914 | 80-TQFP (14x14) | 12ns | 36Kb 4K x 9 | Volatile | 4.5V~5.5V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64CVSSJP | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 5.23mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | 3V | YES | 1.27mm | S-PDSO-G8 | 2.7V | 3.6V | AEC-Q100 | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 8MX8 | 8 | 67108864 bit | SERIAL | 80MHz | 2.7V | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24C04AN-10SI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C04 | 8-SOIC | 900ns | 4Kb 512 x 8 | Non-Volatile | 4.5V~5.5V | 400kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25AA020AT-I/OT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Surface Mount | Tape & Reel (TR) | 2007 | yes | Active | 1 (Unlimited) | 6 | SMD/SMT | EAR99 | 5V | 3.1mm | ROHS3 Compliant | Lead Free | No | 6 | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | SOT-23-6 | SPI, Serial | No SVHC | 2 kb | 1.3mm | 1.8mm | Surface Mount | -40°C~85°C TA | CMOS | 8542.32.00.51 | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 40 | 25AA020A | 6 | 0.95mm | 1.8V | 50 ns | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S34ML02G104BHB010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 20 Weeks | Tray | Automotive, AEC-Q100, ML-1 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63-VFBGA | 9mm | Surface Mount | -40°C~105°C TA | FLASH - NAND | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B63 | 2.7V | 3.6V | 2Gb 128M x 16 | Non-Volatile | 2.7V~3.6V | 128MX16 | 16 | 2147483648 bit | 3V | FLASH | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL256P11FFI013 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tape & Reel (TR) | 2004 | GL-P | Active | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | No | 64 | 64-LBGA | 256 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 110mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | 1mm | 2.7V | 3/3.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 256MX1 | 1 | Asynchronous | 8b | 0.000005A | 110 ns | 8 | 3V | YES | YES | YES | 256 | 8/16words | YES | YES | FLASH | Parallel | 110ns | 128K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NAND512W3A2SZAXE | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | 2012 | Obsolete | 3 (168 Hours) | 63 | 3V | 11mm | ROHS3 Compliant | No | 63 | 63-TFBGA | 512 Mb | Surface Mount | -40°C~85°C TA | 3.3V | FLASH - NAND | 1.05mm | 1 | BOTTOM | 3V | NAND512 | YES | 0.8mm | 3.3V | 512Mb 64M x 8 | Non-Volatile | 26b | 0.02mA | 2.7V~3.6V | 64MX8 | 8 | 0.00005A | 35 ns | NO | NO | YES | 4K | 528B | YES | FLASH | Parallel | 50ns | 16K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V2559S75BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.275mA | 256KX18 | 18 | 4718592 bit | 100MHz | 0.04A | 7.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42VM16800H-75BLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Surface Mount | Tape & Reel (TR) | Active | 3 (168 Hours) | 1.8V | ROHS3 Compliant | Lead Free | Copper, Silver, Tin | 54 | 54-TFBGA | 1 Gb | Surface Mount | -40°C~85°C TA | SDRAM - Mobile | 6ns | 128Mb 8M x 16 | Volatile | 12b | 1.7V~1.95V | 16b | 133MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29RZ4C8DZZMHAN-18W.80D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Not For New Designs | -25°C~85°C TA | FLASH - NAND, DRAM - LPDDR2 | 4Gb 256M x 16 N 4G 128M x 32 LPDDR2 | Non-Volatile | 1.8V | 533MHz | FLASH, RAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7143SA20PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | 100 | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | 310mA | 20 ns | RAM, SRAM | 22b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT28F800B5WG-8 BET TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2002 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | MT28F800B5 | 48-TSOP I | 80ns | 8Mb 1M x 8 512K x 16 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 80ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BQ4013YMA-85 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 32-DIP Module (0.61, 15.49mm) | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 32-DIP Module (18.42x42.8) | 85ns | 1Mb 128K x 8 | Non-Volatile | 4.5V~5.5V | NVSRAM | Parallel | 85ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT48LC4M32B2P-6A AAT:L TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2016 | Automotive, AEC-Q100 | Last Time Buy | 3 (168 Hours) | ROHS3 Compliant | 86-TFSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~105°C TA | SDRAM | MT48LC4M32B2 | 5.4ns | 128Mb 4M x 32 | Volatile | 3V~3.6V | 167MHz | DRAM | Parallel | 12ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48V8M32LFB5-8 IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | Obsolete | 2 (1 Year) | ROHS3 Compliant | 90-VFBGA | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPSDR | MT48V8M32 | 90-VFBGA (8x13) | 7ns | 256Mb 8M x 32 | Volatile | 2.3V~2.7V | 125MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1568KV18-550BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 72 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II+ | 1 | 760mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C1568 | 165 | 3-STATE | 450 ps | 72Mb 4M x 18 | Volatile | 21b | 1.7V~1.9V | 18 | Synchronous | 550MHz | 0.38A | 18b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62168GN30-45BVXIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 48 | 8mm | ROHS3 Compliant | 6mm | CMOS | ASYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | INDUSTRIAL | YES | 0.75mm | R-PBGA-B48 | 2.2V | 85°C | -40°C | 3.6V | 2MX8 | 8 | 16777216 bit | STANDARD SRAM | PARALLEL | 45 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
6116LA25SOG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 5V | 1 | 15.4mm | RoHS Compliant | Lead Free | No | 24 | SOIC | Parallel | 5.5V | 4.5V | 16 kb | 7.6mm | 2.34mm | CMOS | 1 | 95mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 30 | 24 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.00003A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY14B256KA-SP45XIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | Active | 3 (168 Hours) | 48 | EAR99 | 3V | 15.875mm | ROHS3 Compliant | Lead Free | Gold, Tin | No | 48 | 48-BSSOP (0.295, 7.50mm Width) | 256 kb | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | 2.794mm | 8542.32.00.41 | 52mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 3V | 30 | CY14*256 | 48 | 0.635mm | Clock | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | HH:MM:SS | 8b | 0.032MHz | 8b | 1 | NVSRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42S16400J-6BL | ISSI, Integrated Silicon Solution Inc | 1.9250 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 8mm | ROHS3 Compliant | No | 54 | AUTO/SELF REFRESH | 54-TFBGA | 64 Mb | Surface Mount | 0°C~70°C TA | SDRAM | 1.2mm | 1 | 100mA | BOTTOM | 3.3V | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 64Mb 4M x 16 | Volatile | 14b | 3V~3.6V | 4MX16 | 16 | 16b | 166MHz | COMMON | NO | 4096 | YES | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC128XT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 128 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 25LC128 | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 50 ns | 128Kb 16K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S166BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 18 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | YES | 2.375V | SRAMs | 2.625V | 3-STATE | RAM, SRAM | 20b | 0.265mA | 0.06A | 3.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3319S133BFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 133MHz | 1.4mm | 15mm | 1.4mm | CMOS | 480mA | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 18b | Synchronous | 0.04A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC512-I/W16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | -40°C~85°C TA | EEPROM | 25LC512 | Die | 512Kb 64K x 8 | Non-Volatile | 2.5V~5.5V | 20MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71P79804S267BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | RoHS Compliant | 165 | FBGA | Parallel | 267MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.8V | 20 | 165 | COMMERCIAL | YES | 1mm | 1.7V | SRAMs | Not Qualified | 1.5/1.81.8V | 1.9V | 3-STATE | DDR, RAM, SRAM | 0.95mA | 1MX18 | 18 | 18874368 bit | 0.42A | 0.45 ns | SEPARATE | 1.7V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1041CV33-20ZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 44-TSOP II | 20ns | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 20ns |
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