Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IDT71V67802S150PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 150MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.325mA | 512KX18 | 18 | 9437184 bit | 0.05A | 3.8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75902S75BGG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71T75 | 119-PBGA (14x22) | 7.5ns | 18Mb 1M x 18 | Volatile | 2.375V~2.625V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H128M4CB-3:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2006 | Obsolete | 5 (48 Hours) | 60 | EAR99 | 1.8V | 1 | 12mm | ROHS3 Compliant | Lead Free | 60 | AUTO/SELF REFRESH | 60-FBGA | not_compliant | 512 Mb | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 180mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT47H128M4 | 60 | 0.8mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 450ps | 512Mb 128M x 4 | Volatile | 16b | 1.7V~1.9V | 128MX4 | 4 | 333MHz | 0.007A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||
 |
MT41K512M8DA-107:P TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 4Gb 512M x 8 | Volatile | 1.283V~1.45V | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V256SA12YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 3.3V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 3.6V | 3V | 256 kb | 7.6mm | 2.67mm | CMOS | 3.556mm | 1 | 90mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 28 | COMMERCIAL | SRAMs | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.002A | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1315TV18-167BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 165-FBGA (13x15) | 18Mb 512K x 36 | Volatile | 1.7V~1.9V | 167MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61LV12824-10TQLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | yes | Active | 3 (168 Hours) | 100 | 3.3V | 1 | 20mm | ROHS3 Compliant | No | 100 | 100-LQFP | 3 Mb | Surface Mount | 657.000198mg | -40°C~85°C TA | SRAM - Asynchronous | 210mA | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40 | 100 | YES | 0.65mm | 2.97V | 3.63V | 3-STATE | 3Mb 128K x 24 | Volatile | 17b | 3.135V~3.6V | 24 | Asynchronous | 0.02A | 24b | COMMON | 3V | SRAM | Parallel | 10ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7519S200BC | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | Active | 4 (72 Hours) | Non-RoHS Compliant | 256-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V7519 | 256-CABGA (17x17) | 3.4ns | 9Mb 256K x 36 | Volatile | 3.15V~3.45V | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IDT71V25761YSA200BGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V25761 | 119-PBGA (14x22) | 5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3558SA200BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2013 | yes | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | RoHS Compliant | 165 | Parallel | unknown | 200MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.4mA | 256KX18 | 18 | 4718592 bit | 0.04A | 3.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT29VZZZBC9FQOPR-053 W.G9G") |
MT29VZZZBC9FQOPR-053 W.G9G | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 26 Weeks | Bulk | Active | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761S166BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | no | Discontinued | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
|
70V07L25J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 256 kb | 24mm | 3.63mm | CMOS | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.003A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V546S133PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2007 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 310mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
|
S40410161B1B1W010 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | e.MMC 1B1 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | 153-VFBGA | 16Gb 2G x 8 | Non-Volatile | 2.7V~3.6V | 200MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
584271-003-00 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Not Applicable | ROHS3 Compliant | TSOP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256SA20YG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 5.5V | 4.5V | 256 kb | 7.6mm | 2.67mm | CMOS | 3.556mm | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7S1041G30-10ZSXIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 44 | 3A991.B.2.A | 18.415mm | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1.194mm | 8542.32.00.41 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G44 | 2.2V | 3.6V | 4Mb 256K x 16 | Volatile | 2.2V~3.6V | 256KX16 | 16 | 4194304 bit | 10 ns | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M58LR128KT85ZB6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 56 | 56-VFBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | M58LR128 | 56-VFBGA (7.7x9) | 85ns | 128Mb 8M x 16 | Non-Volatile | 1.7V~2V | 66MHz | FLASH | Parallel | 85ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F256G08CKCABH2-12:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 100-TBGA | Surface Mount | 0°C~70°C TA | FLASH - NAND | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | 83MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V35761SA200BQ | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V35761 | 165-CABGA (13x15) | 3.1ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71342LA45JI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 52-LCC (J-Lead) | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 32Kb 4K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
EDFA232A2MA-JD-F-D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | Obsolete | 3 (168 Hours) | 178 | 1.2V | 1 | 11.5mm | ROHS3 Compliant | Copper, Silver, Tin | 178 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; IT ALSO HAVE 0.65 MM PITCH | FBGA | unknown | 16 Gb | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | SYNCHRONOUS | 1mm | 1 | 933MHz | BOTTOM | NOT SPECIFIED | 1.2V | NOT SPECIFIED | 0.8mm | 1.14V | 1.3V | 16Gb 512M x 32 | Volatile | 1.14V~1.95V | 512MX32 | 32 | 32b | DUAL BANK PAGE BURST | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28F800B5SG-8 TET | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2002 | no | Obsolete | 1 (Unlimited) | 44 | EAR99 | 28.195mm | Non-RoHS Compliant | 100,000 ERASE CYCLES; TOP BOOT BLOCK | 44-SOIC (0.496, 12.60mm Width) | not_compliant | 12.6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 2.7mm | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | 235 | 5V | 30 | MT28F800B5 | 44 | YES | 1.27mm | R-PDSO-G44 | 4.5V | Not Qualified | 5V | 5.5V | 3-STATE | 8Mb 1M x 8 512K x 16 | Non-Volatile | 0.055mA | 4.5V~5.5V | 512KX16 | 16 | 8388608 bit | 0.000005A | 80 ns | 8 | 5V | NO | NO | YES | 1217 | FLASH | Parallel | 80ns | 16K8K96K128K | TOP | |||||||||||||||||||||||||||||||||||||||||
|
MT29F1T08CPCABH8-6:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | Obsolete | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | Parallel | 0°C~70°C TA | FLASH - NAND | 1Tb 128G x 8 | Non-Volatile | 2.7V~3.6V | 166MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
X28HC256JIZ-15 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Active | 3 (168 Hours) | 32 | 13.97mm | ROHS3 Compliant | 32-LCC (J-Lead) | 11.43mm | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 3.55mm | 1 | e3 | Matte Tin (Sn) | QUAD | NOT SPECIFIED | 5V | NOT SPECIFIED | X28HC256 | 32 | YES | 1.27mm | R-PQCC-J32 | 4.5V | 5.5V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 5ms | 5V | EEPROM | Parallel | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3399S166BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 2.3 Mb | 166MHz | 17mm | 1.4mm | CMOS | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 34b | Synchronous | 0.03A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709089S15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 28.5MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 325mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | FLAT | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | Synchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
 |
70T631S15BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2005 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 2.6V | 2.4V | 4 Mb | 15mm | 1.4mm | CMOS | 1.5mm | 1 | 305mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM | 36b | Asynchronous | 0.01A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA166BQGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | 165 | PIPELINED ARCHITECTURE | FBGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 13mm | 1.2mm | CMOS | 1 | 330mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | SRAMs | Not Qualified | 3-STATE | 3.5 ns | RAM, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON |
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IDT71V67802S150PF8 Integrated Device Technology (IDT)
2.53.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
-
MT47H128M4CB-3:B Micron Technology Inc.
Surface Mount 60 Pin Memory IC MT47H128M4 512 Mb kb 12mm mm 180mA mA
Price: 0.0000
RFQ -
-
71V256SA12YG8 Integrated Device Technology (IDT)
Surface Mount 28 Pin Memory IC 256 kb kb 17.9mm mm 90mA mA 8b b
Price: 0.0000
RFQ -
-
IS61LV12824-10TQLI ISSI, Integrated Silicon Solution Inc
100 Pin Memory IC 3 Mb kb 20mm mm 210mA mA 24b b
Price: 0.0000
RFQ -
-
-
IDT71V3558SA200BQG Integrated Device Technology (IDT)
3.3V V 165 Pin Memory IC 15mm mm
Price: 0.0000
RFQ -
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71V35761S166BG8 Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 4.5 Mb kb 14mm mm 320mA mA 36b b
Price: 0.0000
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Surface Mount 68 Pin Memory IC 256 kb kb 24mm mm 140mA mA 8b b
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Surface Mount 100 Pin Memory IC 4.5 Mb kb 20mm mm 310mA mA 36b b
Price: 0.0000
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71256SA20YG Integrated Device Technology (IDT)
5V V Surface Mount 28 Pin Memory IC 256 kb kb 17.9mm mm 145mA mA 8b b
Price: 0.0000
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EDFA232A2MA-JD-F-D Micron Technology Inc.
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32 Pin Memory IC X28HC256 13.97mm mm
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Price: 0.0000
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