Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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71V3577S65PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | LQFP | Parallel | 4.5 Mb | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 100 | COMMERCIAL | YES | 3.465V | RAM, SRAM | 17b | 6.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT29C512-90PI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | AT29C512 | 90ns | 512Kb 64K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29C2G24MAABAHAMD-5 IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 130-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND, Mobile LPDRAM | MT29C2G24M | 2Gb 128M x 16 N 1Gb 64M x 16 LPDRAM | Non-Volatile | 1.7V~1.95V | 200MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V25761S183BGI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V25761 | 119-PBGA (14x22) | 3.3ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 183MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY7C1355C-133BGC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | NoBL™ | no | Obsolete | 3 (168 Hours) | 119 | 22mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | 119-BGA | unknown | 14mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 2.4mm | 1 | e0 | TIN LEAD | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | YES | 1.27mm | R-PBGA-B119 | 3.135V | COMMERCIAL | 3.6V | 6.5ns | 9Mb 256K x 36 | Volatile | 3.135V~3.6V | 256KX36 | 36 | 9437184 bit | 133MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T3339S133BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W632GU8KB-12 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Discontinued | 3 (168 Hours) | 78 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-TFBGA | 8mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 8542.32.00.36 | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | 78 | YES | 0.8mm | R-PBGA-B78 | 1.283V | Not Qualified | 1.35V | 1.45V | 3-STATE | 20ns | 2Gb 256M x 8 | Volatile | 0.34mA | 1.283V~1.45V | 256MX8 | 8 | 2147483648 bit | 800MHz | 0.019A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q80EWSVIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.9mm | 1 | DUAL | 1.8V | YES | 1.27mm | R-PDSO-G8 | 1.65V | Not Qualified | 1.8V | 1.95V | 8Mb 1M x 8 | Non-Volatile | 0.02mA | 1.65V~1.95V | 8MX1 | 1 | 8388608 bit | 104MHz | 0.0000075A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST38VF6401-90-5I-EKE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 1 Weeks | Tray | 2000 | SST38 | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3.3V | 18.4mm | ROHS3 Compliant | Lead Free | No | 48 | BOTTOM BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | 64 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | SST38VF6401 | 48 | YES | 0.5mm | 2.7V | 3.6V | 90ns | 64Mb 4M x 16 | Non-Volatile | 22b | 2.7V~3.6V | 4MX16 | 16 | Asynchronous | 16b | 0.00003A | 16b | 2.7V | YES | YES | YES | 1K | 4words | YES | YES | FLASH | Parallel | 10μs | 4K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||
 |
71V2546S150PFG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V2546 | 100-TQFP (14x14) | 3.8ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 150MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H8M32LFB5-75:H | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2009 | Obsolete | 3 (168 Hours) | 90 | 1.8V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 90 | AUTO/SELF REFRESH | 90-VFBGA | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM - Mobile LPSDR | 1mm | 1 | 100mA | BOTTOM | 1.8V | MT48H8M32 | 0.8mm | 1.7V | 1.95V | 5.4ns | 256Mb 8M x 32 | Volatile | 14b | 1.7V~1.95V | 8MX32 | 32 | 32b | 133MHz | 0.00001A | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61QDPB42M36A1-500B4LI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 15mm | ROHS3 Compliant | 165 | 165-LBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, QUADP | 1.4mm | 1 | BOTTOM | 1.8V | YES | 1mm | 1.71V | Not Qualified | 1.8V | 1.89V | 3-STATE | 8.4ns | 72Mb 2M x 36 | Volatile | 1.2mA | 1.71V~1.89V | 2MX36 | 36 | 75497472 bit | 500MHz | 0.36A | SEPARATE | 1.71V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V2558S100BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | 100MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 256KX18 | 18 | 4718592 bit | 0.04A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "7052S35GB") |
7052S35GB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Bulk | 2009 | Active | 125°C | -55°C | 5V | 4 | 30.48mm | RoHS Compliant | Contains Lead | No | 108 | Parallel | 5.5V | 4.5V | 16 kb | 30.48mm | 3.68mm | 360mA | 35 ns | 2kB | RAM, SDR, SRAM | 11b | Asynchronous | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61NVP409618B-250B3L | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165-TBGA | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 2.5V | 10 | 165 | YES | 1mm | R-PBGA-B165 | 2.375V | Not Qualified | 2.5V | 2.625V | 3-STATE | 2.8ns | 72Mb 4M x 18 | Volatile | 0.25mA | 2.375V~2.625V | 4MX18 | 18 | 75497472 bit | 250MHz | COMMON | 2.38V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71V2556S166PFG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V2556 | 100-TQFP (14x14) | 3.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 166MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71V3558SA166BQGI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3558 | 165-CABGA (13x15) | 3.5ns | 4.5Mb 256K x 18 | Volatile | 3.135V~3.465V | 166MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T651S12BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 2.6V | 2.4V | 9 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 12 ns | 1.1MB | RAM, SDR, SRAM | 18b | Asynchronous | 0.01A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9279L6PRF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2008 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | TQFP | Parallel | 3.6V | 3V | 512 kb | 52.6MHz | 14mm | 1.4mm | CMOS | 350mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 6 ns | 64kB | RAM, SDR, SRAM | 30b | Synchronous | 0.003A | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V5388S200BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2008 | no | Discontinued | 3 (168 Hours) | 256 | 3A991.B.2.A | 70°C | 0°C | 3.3V | 4 | 17mm | RoHS Compliant | Contains Lead | No | 256 | PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 1.1 Mb | 200MHz | 1.4mm | 17mm | 1.4mm | CMOS | 1 | 470mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 3 ns | RAM, SRAM | 16b | Synchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q128FVCJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~105°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7164L20YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 5V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 5.5V | 4.5V | 64 kb | 7.6mm | 2.67mm | CMOS | 3.556mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM - Asynchronous | 13b | 8KX8 | Asynchronous | 0.00006A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
N25Q128A13BSF40F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2011 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | N25Q128 | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI | 8ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC64GAJAEDQ-AIT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | e•MMC™ | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 512Gb 64G x 8 | Non-Volatile | 2.7V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S75BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | FLOW THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 117MHz | 2.15mm | 22mm | 2.15mm | CMOS | 255mA | 1 | 255mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 117MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC128T-I/MNY | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2010 | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Gold | No | 8 | 8-WFDFN Exposed Pad | I2C, Serial | No SVHC | 128 kb | 750μm | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e4 | DUAL | 260 | 4.5V | 40 | 24LC128 | 8 | YES | 0.5mm | 2.5V | 3/5V | 5.5V | 900ns | 128Kb 16K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IS61QDPB21M18A-333M3L | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 17mm | ROHS3 Compliant | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QUADP | 1.4mm | 8542.32.00.41 | 1 | BOTTOM | 1.8V | 165 | YES | 1mm | 1.71V | Not Qualified | 1.5/1.81.8V | 1.89V | 3-STATE | 8.4ns | 18Mb 1M x 18 | Volatile | 1.15mA | 1.71V~1.89V | 1MX18 | 18 | 18874368 bit | 333MHz | 0.29A | SEPARATE | 1.7V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS29GL512S-11DHV013 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | GL-S | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-FBGA (9x9) | 110ns | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W9725G8KB-18 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 60 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | BOTTOM | 1.8V | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | 1.9V | 350ps | 256Mb 32M x 8 | Volatile | 1.7V~1.9V | 32MX8 | 8 | 268435456 bit | 533MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7016S20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | PLCC | Parallel | 5.5V | 4.5V | 144 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 18kB | RAM, SDR, SRAM | 28b | 16KX9 | Asynchronous | 0.015A | 9b | COMMON |
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71V3577S65PFG8 Integrated Device Technology (IDT)
100 Pin Memory IC 4.5 Mb kb 20mm mm
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CY7C1355C-133BGC Rochester Electronics, LLC
NoBL™ 119 Pin Memory IC NoBL™ Series 22mm mm
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70T3339S133BF8 Integrated Device Technology (IDT)
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W25Q80EWSVIG Winbond Electronics
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MT48H8M32LFB5-75:H Micron Technology Inc.
Surface Mount Memory IC MT48H8M32 256 Mb kb 8mm mm 100mA mA
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IS61QDPB42M36A1-500B4LI ISSI, Integrated Silicon Solution Inc
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70T651S12BC Integrated Device Technology (IDT)
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71V3577S75BGG Integrated Device Technology (IDT)
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7016S20J Integrated Device Technology (IDT)
5V V Surface Mount 68 Pin Memory IC 144 kb kb 24mm mm 290mA mA 9b b
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RFQ
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