Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CY7C1360C-200BGC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | no | Active | 3 (168 Hours) | 119 | 3A991.B.2.A | 3.3V | 4 | 22mm | Non-RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | 119-BGA | 9 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 1 | 220mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 220 | 3.3V | 20 | CY7C1360 | 119 | 1.27mm | 3.135V | 3.6V | 3-STATE | 3ns | 9Mb 256K x 36 | Volatile | 18b | 3.135V~3.6V | 256KX36 | 36 | Synchronous | 200MHz | 36b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX29GL512FLXFI-11G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 64 | 85°C | -40°C | 3.6V | 13mm | RoHS Compliant | Lead Free | Parallel | 512 Mb | 11mm | CMOS | ASYNCHRONOUS | 1.4mm | 1 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 3V | 40 | INDUSTRIAL | YES | 1mm | R-PBGA-B64 | 2.7V | Flash Memories | Not Qualified | 3/3.3V | 110 ns | FLASH, NOR | 0.03mA | 32MX16 | 16 | 0.00002A | 8 | 3V | YES | YES | 512 | 8/16words | YES | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S25FL512SAGBHBC13 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100, FL-S | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | ITS ALSO CONFIGURABLE AS 512MX1 | 24-TBGA | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | AEC-Q100; TS 16949 | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 64MX8 | 8 | 512753664 bit | SERIAL | 133MHz | 1 | 3V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC66AXT/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 5.5V | 4.9mm | ROHS3 Compliant | Lead Free | No | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, Serial | 4 kb | 3.9mm | Surface Mount | 0°C~70°C TA | CMOS | 1.75mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 93LC66A | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | 3/5V | 6V | 6 ms | 4Kb 512 x 8 | Non-Volatile | 0.003mA | 2.5V~5.5V | 512X8 | 8 | 2MHz | 0.00003A | 10 | 100000 Write/Erase Cycles | SOFTWARE | MICROWIRE | EEPROM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
25LC320/S | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Active | 1 (Unlimited) | 8 | EAR99 | ROHS3 Compliant | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | Die | Surface Mount | 0°C~70°C TA | CMOS | SYNCHRONOUS | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 40 | 25LC320 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/5V | 5.5V | 32Kb 4K x 8 | Non-Volatile | 0.005mA | 2.5V~5.5V | 4KX8 | 8 | 32768 bit | SERIAL | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67602S150PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2004 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 14mm | 1.4mm | CMOS | 1 | 305mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 3.8 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA166BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 576kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3558S200BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 165 | 70°C | 0°C | Non-RoHS Compliant | 165 | Parallel | not_compliant | 200MHz | CMOS | SYNCHRONOUS | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | COMMERCIAL | YES | 1mm | SRAMs | Not Qualified | 3.3V | 3-STATE | RAM, SRAM | 0.4mA | 256KX18 | 18 | 4718592 bit | 0.04A | 3.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT29C256-70TC-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | 0°C~70°C TC | AT29C256 | 70ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2015 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3569S4BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2008 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 576 kb | 133MHz | 17mm | 1.4mm | CMOS | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 7.5 ns | 72kB | RAM, SDR, SRAM | 28b | 16KX36 | Synchronous | 0.015A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q64JVZEIM | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | SpiFlash® | yes | Active | 3 (168 Hours) | 8 | 8mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 8MX8 | 8 | 67108864 bit | SERIAL | 133MHz | 3V | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1513JV18-250BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | 165 | 1.8V | 2 | 17mm | ROHS3 Compliant | 165 | PIPELINED ARCHITECTURE | 165-LBGA | unknown | 72 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | BOTTOM | 260 | 1.8V | NOT SPECIFIED | CY7C1513 | 165 | YES | 1mm | 1.7V | Not Qualified | 1.9V | 450 ps | 72Mb 4M x 18 | Volatile | 20b | 1.7V~1.9V | 4MX18 | 18 | 250MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H16M16LFBF-75:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | Discontinued | 3 (168 Hours) | 60 | EAR99 | 1.8V | 1 | 9mm | ROHS3 Compliant | Lead Free | 60 | AUTO/SELF REFRESH | 60-VFBGA | unknown | 8mm | Surface Mount | 0°C~70°C TA | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | 8542.32.00.24 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT46H16M16 | 60 | YES | 0.8mm | 1.7V | Not Qualified | 1.95V | 3-STATE | 6ns | 256Mb 16M x 16 | Volatile | 0.1mA | 1.7V~1.95V | 16MX16 | 16 | 268435456 bit | 133MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R1LV5256ESP-5SI#B0 | Renesas | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 28 | EAR99 | 85°C | -40°C | 3V | 1 | RoHS Compliant | Lead Free | No | 28 | SOP | Parallel | 256 kb | 1MHz | CMOS | 2.4mm | 1 | DUAL | GULL WING | 3V | 28 | INDUSTRIAL | YES | 2.7V | SRAMs | 3.6V | 3-STATE | 55 ns | RAM, SRAM | 15b | 0.025mA | 32KX8 | 8 | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62147EV30LL-45BVXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | 2001 | MoBL® | yes | Active | 3 (168 Hours) | 48 | 3V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 48 | 48-VFBGA | No SVHC | 4 Mb | 45GHz | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 20mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 30 | CY62147 | 48 | 0.75mm | 2.2V | 3.6V | 3-STATE | 4Mb 256K x 16 | Volatile | 18b | 2.2V~3.6V | 16 | Asynchronous | 0.000007A | 45 ns | 16b | COMMON | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C64D-SSHM-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 3 (168 Hours) | 8 | 5V | 4.925mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C | No SVHC | 64 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 8S1-8 | 1 | 3mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 40 | AT24C64D | 1.27mm | 1.7V | 550ns | 64Kb 8K x 8 | Non-Volatile | 1.7V~5.5V | 8 | SERIAL | 1MHz | 0.000001A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT24C08A-UTR-T | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Cut Tape (CT) | 2010 | yes | Discontinued | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | unknown | 3mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | 1.1mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 0.65mm | 2.5V | 5.5V | 550ns | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT93C46A-IDR-B | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2010 | Discontinued | 1 (Unlimited) | 8 | 9.2mm | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | Serial | unknown | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 4.31mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | NO | 2.54mm | R-PDIP-T8 | 1.8V | 5.5V | 1Kb 128 x 8 64 x 16 | Non-Volatile | 1.8V~5.5V | 64X16 | 16 | 1024 bit | 2MHz | 8 | 10ms | 3-WIRE | EEPROM | SPI | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "7005S55JI8") |
7005S55JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 1 (Unlimited) | 68 | EAR99 | 85°C | -40°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 24mm | 3.63mm | CMOS | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 55 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | Asynchronous | 0.03A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q32JVTBIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43TR82560C-125KBLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 78 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 78-TFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.5V | 10 | YES | 0.8mm | R-PBGA-B78 | 1.425V | 1.575V | 20ns | 2Gb 256M x 8 | Volatile | 1.425V~1.575V | 256MX8 | 8 | 2147483648 bit | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32400D-7T-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Discontinued | 2 (1 Year) | 70°C | 0°C | Non-RoHS Compliant | 86-TFSOP (0.400, 10.16mm Width) | Parallel | 143MHz | Surface Mount | 0°C~70°C TA | SDRAM | 86-TSOP II | 5.4ns | 128Mb 4M x 32 | Volatile | 3V~3.6V | 143MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS25LQ025B-JKLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | SPI, Serial | 5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.3V | 3.6V | 256Kb 32K x 8 | Non-Volatile | 2.3V~3.6V | 256KX1 | 1 | 262144 bit | 104MHz | 3V | FLASH | SPI - Quad I/O | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA15TPI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Rail/Tube | 2010 | 85°C | -40°C | 5V | 1 | Non-RoHS Compliant | 28 | PDIP | Parallel | 5.5V | 4.5V | 256 kb | 150mA | 15 ns | RAM, SRAM - Asynchronous | 15b | Asynchronous | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M28W320ECB70ZB6T TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 1998 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 47-TFBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | M28W320 | 32Mb 2M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC1026-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2001 | Active | 1 (Unlimited) | 8 | EAR99 | 10.16mm | ROHS3 Compliant | Tin | No | 8 | 200 YEARS DATA RETENTION | 8-DIP (0.300, 7.62mm) | I2C, Serial | No SVHC | 1 Mb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 5mA | e3 | DUAL | 5V | 24LC1026 | 8 | NO | 2.54mm | 2.5V | 3/5V | 5.5V | 900ns | 1Mb 128K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX29GL320EBTI-70G | Macronix | 3.5412 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | MX29GL | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3.6V | 18.4mm | ROHS3 Compliant | Lead Free | BOTTOM BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | 32 Mb | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e3 | Tin (Sn) | DUAL | 260 | 3V | 30 | 48 | YES | 0.5mm | R-PDSO-G48 | 2.7V | Not Qualified | 3/3.3V | 32Mb 4M x 8 | Non-Volatile | 0.1mA | 2.7V~3.6V | 2MX16 | 16 | 0.0001A | 70 ns | 8 | 3V | YES | YES | YES | 863 | 8/16words | YES | YES | FLASH | Parallel | 70ns | 8K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||
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W29GL512SL9B | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Not For New Designs | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-LBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-LFBGA (11x13) | 90ns | 512Mb 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 90ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CAT25020LI-G | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | EEPROM | 8-PDIP | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 20MHz | EEPROM | SPI | 5ms |
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