Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CY7C1413BV18-200BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 165 | 17mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | 165-LBGA | unknown | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | e0 | TIN LEAD | BOTTOM | 1.8V | 165 | YES | 1mm | R-PBGA-B165 | 1.7V | COMMERCIAL | 1.9V | 36Mb 2M x 18 | Volatile | 1.7V~1.9V | 2MX18 | 18 | 37748736 bit | 200MHz | 0.45 ns | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS4C128M8D3A-12BANTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | -40°C~105°C TC | SDRAM - DDR3 | 20ns | 1Gb 128M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M24C04-RMB6TG | STMicroelectronics | 1.2943 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 5V | 2mm | ROHS3 Compliant | No | 8 | 8-UFDFN Exposed Pad | 2-Wire, I2C, Serial | No SVHC | 4 kb | 530μm | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 800μA | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 2.5V | 30 | M24C04 | 8 | 0.5mm | 900ns | 4Kb 512 x 8 | Non-Volatile | 1.8V~5.5V | 400kHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT25160B-MAHL-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 3 (168 Hours) | 8 | 3mm | ROHS3 Compliant | Gold | No | 8 | 8-UFDFN Exposed Pad | SPI, Serial | 16 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 0.6mm | 1 | 10mA | e4 | DUAL | 260 | 2.5V | 40 | AT25160 | 0.5mm | 2/5V | 5.5V | 80 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 20MHz | 100 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT48LC8M16A2P-6A IT:L | Micron Technology Inc. | 21.5717 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | 2012 | yes | Active | 3 (168 Hours) | 54 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.02 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3.3V | 30 | MT48LC8M16A2 | 54 | YES | 0.8mm | R-PDSO-G54 | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | AEC-Q100 | 128Mb 8M x 16 | Volatile | 0.1mA | 3V~3.6V | 8MX16 | 16 | 134217728 bit | 167MHz | 0.0025A | COMMON | 4096 | DRAM | Parallel | 12ns | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||
.png "MT38M5071A3063RZZI.YE8") |
MT38M5071A3063RZZI.YE8 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | RoHS Compliant | 133-VFBGA | Surface Mount | -40°C~85°C TA | FLASH, PSRAM | 133-VFBGA (8x8) | 512Mb 32M x 16 512Mb 32M x 16 | Non-Volatile | 1.7V~1.95V | 133MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V424YS15PH8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 70°C | 0°C | Non-RoHS Compliant | TSOP | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S25FL116K0XBHI020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2007 | FL1-K | Obsolete | 3 (168 Hours) | 24 | 3V | 8mm | ROHS3 Compliant | 24 | ALSO CONFIGURABLE AS 16M X 1 | 24-TBGA | SPI, Serial | 16 Mb | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | 2.7V | Not Qualified | 3.6V | 16Mb 2M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 4MX4 | 4 | 108MHz | 0.000005A | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||
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AT25128AN-10SU-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 5V | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 5.5V | 2.7V | 128 kb | 20MHz | Surface Mount | -40°C~85°C TA | EEPROM | 10mA | 10MHz | AT25128 | 8-SOIC | 40 ns | 128Kb 16K x 8 | Non-Volatile | 2.7V~5.5V | 20MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST26WF040BAT-104I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2014 | SST26 SQI® | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | SPI | 5mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.8mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 1.8V | 30 | SST26WF040 | YES | 1.27mm | R-PDSO-N8 | 1.65V | 1.95V | TS 16949 | 4Mb 512K x 8 | Non-Volatile | 1.65V~1.95V | 4MX1 | 1 | 4194304 bit | SERIAL | 104MHz | 1.8V | FLASH | SPI - Quad I/O | 1.5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC080BT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2007 | Active | 1 (Unlimited) | 85°C | -40°C | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 5.5V | 2.5V | 8 kb | 10MHz | Surface Mount | -40°C~85°C TA | EEPROM | 6mA | 10MHz | 25LC080B | 8-SOIC | 100 ns | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 10MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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47C04T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | IT ALSO HAS EEPROM BACKUP OF 512 X 8 BITS | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C TA | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 47C04 | YES | 0.65mm | R-PDSO-G8 | 4.5V | 5.5V | 400ns | TS 16949 | 4Kb 512 x 8 | Non-Volatile | 4.5V~5.5V | 512X8 | 8 | 4096 bit | 1MHz | EERAM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M93S46-MN6T | STMicroelectronics | 7.7894 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | Non-RoHS Compliant | Contains Lead | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 1 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | DUAL | 5V | M93S46 | 8 | YES | 1.27mm | 5V | 1 μs | 1Kb 64 x 16 | Non-Volatile | 0.002mA | 4.5V~5.5V | 64X16 | 16 | 2MHz | 0.000015A | 40 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V67703S75PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 117MHz | 14mm | 1.4mm | CMOS | 1 | 265mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 7.5 ns | 117MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V2546S133BG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V2546 | 119-PBGA (14x22) | 4.2ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 133MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V67602S166BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | unknown | 166MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 3.3V | 165 | COMMERCIAL | YES | 1mm | 3.135V | Not Qualified | 3.465V | RAM, SRAM | 256KX36 | 36 | 9437184 bit | 3.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
47C16-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 28 Weeks | Tube | Active | Not Applicable | 8 | 9.271mm | ROHS3 Compliant | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 8-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | -40°C~85°C TA | EEPROM, SRAM | SYNCHRONOUS | 5.334mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 5V | 47C16 | NO | 2.54mm | R-PDIP-T8 | 4.5V | 5.5V | 400ns | TS 16949 | 16Kb 2K x 8 | Non-Volatile | 4.5V~5.5V | 2KX8 | 8 | 16384 bit | 1MHz | EERAM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V2546S150BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 325mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.8 ns | RAM, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C146-25JXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | yes | Obsolete | 3 (168 Hours) | 52 | 19.1262mm | ROHS3 Compliant | 52-LCC (J-Lead) | unknown | 19.1262mm | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | 5.08mm | 1 | e3 | TIN | QUAD | 260 | 5V | 20 | 52 | YES | 1.27mm | S-PQCC-J52 | 4.5V | COMMERCIAL | 5.5V | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | 2KX8 | 8 | 16384 bit | 25 ns | SRAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71256S35DB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | 2011 | no | Active | 1 (Unlimited) | 28 | 125°C | -55°C | 5V | 1 | 37.2mm | RoHS Compliant | Contains Lead | No | 28 | CDIP | Parallel | 5.5V | 4.5V | 256 kb | 15.24mm | 1.65mm | CMOS | 5.08mm | 1 | 140mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 28 | MILITARY | 2.54mm | SRAMs | 5V | 3-STATE | 35 ns | MIL-STD-883 Class B | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.02A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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93C76C-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 10.16mm | Non-RoHS Compliant | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | Serial | 8 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 5V | 93C76C | 8 | 2.54mm | 5V | 100 ns | 8Kb 1K x 8 512 x 16 | Non-Volatile | 4.5V~5.5V | 512X16 | 3MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST25PF040C-40I/MF | Microchip Technology | 1.1341 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tube | 2015 | SST25 | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8 | 8-WDFN Exposed Pad | SPI, Serial | No SVHC | 8 b | 5mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 3.3V | SST25PF040C | YES | 1.27mm | 2.3V | 3.6V | 4Mb 512K x 8 | Non-Volatile | 0.015mA | 2.3V~3.6V | 4MX1 | 1 | 40MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3.3V | SPI | NO | FLASH | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY62256NLL-70PXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Through Hole | Tube | 2002 | MoBL® | yes | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 1 | 37.59mm | ROHS3 Compliant | Lead Free | No | 28 | 28-DIP (0.600, 15.24mm) | No SVHC | 256 kb | 1MHz | 5.08mm | 13.97mm | Through Hole | 0°C~70°C TA | SRAM - Asynchronous | 1 | 50mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 5V | 40 | CY62256 | 28 | 2.54mm | 5V | 3-STATE | 256Kb 32K x 8 | Volatile | 15b | 4.5V~5.5V | 32KX8 | Asynchronous | 0.000005A | 70 ns | 8b | COMMON | 2V | SRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||
|
709289L6PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | 6.5ns | 1Mb 64K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71016S15PHG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2004 | yes | Active | 3 (168 Hours) | 44 | 70°C | 0°C | 5V | 1 | 18.41mm | RoHS Compliant | Lead Free | No | 44 | TSOP | Parallel | 5.5V | 4.5V | 1 Mb | 10.16mm | 1mm | CMOS | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 30 | 44 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 15 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 16b | Asynchronous | 16b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70P269L65BYGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel | 2008 | yes | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | RoHS Compliant | No | 100 | TFBGA | Parallel | 3V | 1.8V | 256 kb | CMOS | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 65 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT27LV256A-70TC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2000 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | 0°C~70°C TC | EPROM - OTP | AT27LV256 | 28-TSOP | 70ns | 256Kb 32K x 8 | Non-Volatile | 3V~3.6V 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS61NLP25618A-200TQI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | no | Not For New Designs | 2 (1 Year) | 100 | 3A991.B.2.A | 20mm | Non-RoHS Compliant | 100 | PIPELINED ARCHITECTURE | 100-LQFP | 14mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | QUAD | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 100 | YES | 0.65mm | 3.135V | Not Qualified | 2.5/3.33.3V | 3.465V | 3-STATE | 3.1ns | 4.5Mb 256K x 18 | Volatile | 0.21mA | 3.135V~3.465V | 256KX18 | 18 | 4718592 bit | 200MHz | 0.035A | COMMON | 3.14V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R1LV0108ESA-7SI#B0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Surface Mount | Tray | 2011 | yes | Active | 2 (1 Year) | 32 | EAR99 | 3V | 1 | ROHS3 Compliant | Lead Free | No | 32 | 32-TFSOP (0.465, 11.80mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1 | 25mA | DUAL | 3V | R1LV0108E | 32 | 0.5mm | 2.7V | 3.6V | 3-STATE | 1Mb 128K x 8 | Volatile | 17b | 2.7V~3.6V | 8 | Asynchronous | 0.000002A | 70 ns | 8b | COMMON | 2V | SRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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EDFA164A2PP-GD-F-R | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 220 | 1 | 14mm | RoHS Compliant | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | compliant | 14mm | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | SYNCHRONOUS | 0.99mm | 1 | BOTTOM | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.5mm | S-PBGA-B220 | 1.14V | 1.3V | 220-FBGA (14x14) | 16Gb 256M x 64 | Volatile | 1.14V~1.95V | 256MX64 | 64 | 17179869184 bit | 800MHz | DUAL BANK PAGE BURST | DRAM | Parallel |
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