Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Analog IC - Other Type | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "28302961 A") |
28302961 A | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7024L20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2000 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM | 12b | 4KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||
 |
7038L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 1.1 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 340mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | RAM, SRAM | 16b | 64KX18 | Asynchronous | 0.003A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
70121L25JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2008 | yes | Active | 1 (Unlimited) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Lead Free | 52 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | ASYNCHRONOUS | 4.57mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | NOT SPECIFIED | 52 | COMMERCIAL | YES | SRAMs | Not Qualified | 5V | 3-STATE | 25 ns | 2.3kB | RAM, SDR, SRAM | 22b | 0.005A | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7599S133BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 645mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 25 ns | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43DR16160B-25DBL | ISSI, Integrated Silicon Solution Inc | 2.9128 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 84 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | 84 | AUTO/SELF REFRESH | 84-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 10 | YES | 0.8mm | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 400ps | 256Mb 16M x 16 | Volatile | 0.33mA | 1.7V~1.9V | 16MX16 | 16 | 16b | 400MHz | 0.025A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43R86400D-6TL-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 66 | 1 | 22.22mm | ROHS3 Compliant | 66 | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SDRAM - DDR | SYNCHRONOUS | 370mA | 1.2mm | 1 | e3 | MATTE TIN | DUAL | 225 | 2.5V | NOT SPECIFIED | YES | 0.65mm | 2.3V | Not Qualified | 2.5V | 2.7V | 3-STATE | 700ps | 512Mb 64M x 8 | Volatile | 2.3V~2.7V | 64MX8 | 8 | 536870912 bit | 8b | 166MHz | 0.025A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71321SA20TF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT71321 | 64-TQFP (10x10) | 20ns | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V35761YSA166BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | not_compliant | 166MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.32mA | 128KX36 | 36 | 4718592 bit | 0.03A | 3.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C32D-XPD-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2012 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | RoHS Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | I2C, Serial | 32 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | 400kHz | e4 | NICKEL PALLADIUM GOLD | DUAL | 3V | YES | 0.65mm | 2.5V | 5.5V | 900ns | 32Kb 4K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT6116SA35TPGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 24 | EAR99 | 85°C | -40°C | 31.75mm | RoHS Compliant | DIP | Parallel | 7.62mm | CMOS | 4.191mm | 8542.32.00.41 | 1 | e3 | MATTE TIN | DUAL | THROUGH-HOLE | 260 | 5V | 30 | 24 | INDUSTRIAL | NO | 2.54mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.08mA | 2KX8 | 8 | 16384 bit | 0.002A | 35 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X40CLSVIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2009 | SpiFlash® | Active | 3 (168 Hours) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | DUAL | 3V | 8 | YES | 1.27mm | R-PDSO-G8 | 2.7V | Not Qualified | 2.5/3.3V | 3.6V | 4Mb 512K x 8 | Non-Volatile | 0.015mA | 2.3V~3.6V | 4MX1 | 1 | 4194304 bit | 104MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C128M16D2A-25BIN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2015 | yes | Active | 3 (168 Hours) | 84 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | Lead Free | AUTO/SELF REFRESH | 84-TFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B84 | 1.7V | 1.9V | 2Gb 128M x 16 | Volatile | 1.7V~1.9V | 128MX16 | 16 | 2147483648 bit | 400MHz | 0.4 ns | MULTI BANK PAGE BURST | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29C2G24MAABAKAMD-5 IT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2002 | Obsolete | 3 (168 Hours) | 130 | 9mm | ROHS3 Compliant | ALSO ORGANISED AS 64M X 16 | 130-VFBGA | 8mm | Surface Mount | -40°C~85°C TA | FLASH - NAND, Mobile LPDRAM | SYNCHRONOUS | 1mm | 8542.32.00.71 | 1 | BOTTOM | 1.8V | MT29C2G24M | YES | 0.65mm | R-PBGA-B130 | 1.7V | 1.95V | 2Gb 128M x 16 N 1Gb 32M x 32 LPDRAM | Non-Volatile | 1.7V~1.95V | 32MX32 | 32 | 1073741824 bit | 200MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC56A-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | Tube | 2004 | yes | Active | Not Applicable | 8 | EAR99 | 10.16mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8-DIP (0.300, 7.62mm) | Serial | No SVHC | 2 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | DUAL | 5V | 93LC56A | 8 | 2.54mm | 2.5V | 3/5V | 5.5V | 250 ns | 2Kb 256 x 8 | Non-Volatile | 2.5V~5.5V | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71016S12PHGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | yes | 3 (168 Hours) | 44 | 3A991.B.2.B | 85°C | -40°C | 18.41mm | RoHS Compliant | 44 | TSOP | Parallel | unknown | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 30 | 44 | INDUSTRIAL | YES | 0.8mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.21mA | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7024S25PFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 64Kb 4K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53E256M16D1DS-046 WT:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16400F-5BL-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 3.3V | RoHS Compliant | 54 | 54-TFBGA | 64 Mb | Surface Mount | 0°C~70°C TA | SDRAM | 140mA | 5ns | 64Mb 4M x 16 | Volatile | 14b | 3V~3.6V | 16b | 200MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C128M8D3A-12BINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 1Gb 128M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C080-90JU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 1997 | Active | 3 (168 Hours) | 32 | 13.97mm | ROHS3 Compliant | 32-LCC (J-Lead) | 11.43mm | Surface Mount | -40°C~85°C TC | EPROM - OTP | 3.556mm | 1 | QUAD | 5V | YES | 1.27mm | R-PQCC-J32 | 4.5V | 5.5V | ANALOG CIRCUIT | 90ns | 8Mb 1M x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24FC64-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2007 | yes | Active | 1 (Unlimited) | 8 | 3A991.A.2 | 4.4mm | ROHS3 Compliant | Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | I2C, Serial | 64 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 24FC64 | 8 | 0.65mm | 1.7V | Not Qualified | 2/5V | 5.5V | 400ns | 64Kb 8K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 1MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3558S200BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 165 | 70°C | 0°C | Non-RoHS Compliant | 165 | Parallel | not_compliant | 200MHz | CMOS | SYNCHRONOUS | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | COMMERCIAL | YES | 1mm | SRAMs | Not Qualified | 3.3V | 3-STATE | RAM, SRAM | 0.4mA | 256KX18 | 18 | 4718592 bit | 0.04A | 3.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3559SA75BQGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3559 | 165-CABGA (13x15) | 7.5ns | 4.5Mb 256K x 18 | Volatile | 3.135V~3.465V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3576S133PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2012 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 128KX36 | 36 | 4718592 bit | 0.03A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X32VZEIG T&R | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH | 8-WSON (8x6) | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W9864G6KH-6I | Winbond Electronics | 0.8863 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 54 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G54 | 3V | 3.6V | 5ns | 64Mb 4M x 16 | Volatile | 3V~3.6V | 4MX16 | 16 | 67108864 bit | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256L25YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 20 | 28 | INDUSTRIAL | YES | 1.27mm | 4.5V | Not Qualified | 5.5V | RAM, SRAM - Asynchronous | 32KX8 | 8 | 262144 bit | 25 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA166BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 576kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25Q80CWIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | SERIAL | 120MHz | 3.3V | FLASH | SPI - Quad I/O | 50μs, 2.4ms |
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