Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Self Refresh | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W29N01GVDIAA | Winbond Electronics | 0.8431 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | 2016 | Discontinued | 3 (168 Hours) | 48 | 8mm | ROHS3 Compliant | 48 | 48-VFBGA | unknown | 6.5mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 3.3V | YES | 0.8mm | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 128MX8 | 8 | 1073741824 bit | 3.3V | FLASH | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "AS4C512M8D3B-12BINTR") |
AS4C512M8D3B-12BINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 4Gb 512M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M58WR032KB70ZB6W TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2011 | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | M58WR032 | 32Mb 2M x 16 | Non-Volatile | 1.7V~2V | 66MHz | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1362S-200AXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Obsolete | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | 100-LQFP | Parallel | 200MHz | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | CY7C1362 | 100-TQFP (14x14) | 3ns | 9Mb 512K x 18 | Volatile | 3.135V~3.6V | 200MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS62V256A-70SINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2012 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 28-SOIC (0.330, 8.38mm Width) | unknown | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | NOT SPECIFIED | NOT SPECIFIED | 256Kb 32K x 8 | Volatile | 2.5V~3.6V | SRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL132K0XNFA010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Automotive, AEC-Q100, FL1-K | yes | Obsolete | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | IT IS ALSO CONFIGURED AS 32M X 1 | 8-SOIC (0.209, 5.30mm Width) | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 8MX4 | 4 | 33554432 bit | SERIAL | 108MHz | 2 | 3V | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
47L16-E/ST | Microchip Technology | 26.5356 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C TA | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | 47L16 | YES | 0.65mm | R-PDSO-G8 | 2.7V | 3.6V | 400ns | TS 16949 | 16Kb 2K x 8 | Non-Volatile | 2.7V~3.6V | 2KX8 | 8 | 16384 bit | 1MHz | EERAM | I2C | 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC160D-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | SPI, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 5mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 25LC160D | 8 | 0.65mm | 100 ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43DR86400E-3DBLI | ISSI, Integrated Silicon Solution Inc | 6.5126 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 60 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B60 | 1.7V | 1.9V | 450ns | 512Mb 64M x 8 | Volatile | 1.7V~1.9V | 64MX8 | 8 | 536870912 bit | 333MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V07L35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 35 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.003A | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761S166PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 14mm | 1.4mm | CMOS | 1 | 330mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 3.5 ns | 166MHz | 576kB | RAM, SDR, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V65903S85PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V65903 | 8.5ns | 9Mb 512K x 18 | Volatile | 3.135V~3.465V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL064N90BFI043 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | 2016 | GL-N | Active | 3 (168 Hours) | 48 | 8.15mm | ROHS3 Compliant | No | 48 | 48-VFBGA | 64 Mb | 6.15mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | YES | 0.8mm | 2.7V | 3/3.3V | 3.6V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 0.05mA | 2.7V~3.6V | 4MX16 | 16 | 0.000005A | 90 ns | 8 | 3V | YES | YES | YES | 8127 | 8/16words | YES | YES | FLASH | Parallel | 90ns | 8K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V124SA12TYG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 32 | 70°C | 0°C | 3.3V | 1 | 21.95mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3V | 1 Mb | 7.6mm | 2.67mm | CMOS | 3.7592mm | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67602S150PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2004 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 14mm | 1.4mm | CMOS | 1 | 305mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 3.8 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416S10PHGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2013 | yes | Active | 3 (168 Hours) | 44 | 85°C | -40°C | 3.3V | 1 | 18.41mm | RoHS Compliant | Lead Free | No | 44 | TSOP | Parallel | 3.6V | 3V | 4 Mb | 10.16mm | 1mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 44 | INDUSTRIAL | YES | 0.8mm | 10 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F16G08CBACAWP:C TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2012 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TA | FLASH - NAND | MT29F16G08 | 16Gb 2G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62136EV30LL-45BVXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tray | 2001 | MoBL® | yes | Active | 3 (168 Hours) | 48 | 3V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 48 | 48-VFBGA | 2 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 20mA | 22MHz | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 30 | CY62136 | 48 | 0.75mm | 2.2V | 3.6V | 3-STATE | 2Mb 128K x 16 | Volatile | 17b | 2.2V~3.6V | 16 | Asynchronous | 0.000003A | 45 ns | 16b | COMMON | 1V | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S34MS08G201BHI000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tray | 2008 | MS-2 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | Lead Free | 63 | 63-VFBGA | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.8mm | 1.7V | 1.95V | 8Gb 1G x 8 | Non-Volatile | 1.7V~1.95V | 1GX8 | 8 | 8589934592 bit | 1.8V | FLASH | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49LV1024A-45VL | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 40-TFSOP (0.488, 12.40mm Width) | Surface Mount | 0°C~70°C TC | FLASH | AT49LV1024 | 40-VSOP | 45ns | 1Mb 64K x 16 | Non-Volatile | 3V~3.6V | FLASH | Parallel | 50μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
QMP29GL512P11FFI020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | GL-P | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-FBGA (11x13) | 512Mb 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24C04-WDW6TP | ROHM Semiconductor | 4.0055 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Copper, Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 4 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | DUAL | 8 | 0.65mm | 900 ns | 4Kb 512 x 8 | Non-Volatile | 0.001mA | 2.5V~5.5V | 4KX1 | 1 | 400kHz | 5e-7A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M24C16-WBN6P | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | Obsolete | 1 (Unlimited) | 8 | EAR99 | 6.5V | 9.27mm | ROHS3 Compliant | Lead Free | No | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | No SVHC | 16 kb | 3.3mm | 6.35mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | Matte Tin (Sn) - annealed | DUAL | 5V | M24C16 | 8 | 2.54mm | 2.5V | 3/5V | 5.5V | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Tape & Reel | 2015 | no | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 13mm | 1.2mm | CMOS | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 4.2 ns | RAM, SRAM | 17b | Synchronous | 36b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS46R16160F-5BLA1 | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | Active | 3 (168 Hours) | 60 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 2.5V | NOT SPECIFIED | YES | 1mm | R-PBGA-B60 | 2.3V | 2.7V | 700ps | 256Mb 16M x 16 | Volatile | 2.3V~2.7V | 16MX16 | 16 | 268435456 bit | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PC28F512M29EWHA | Micron Technology Inc. | 14.2183 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Tray | 2011 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | No | 64 | 64-LBGA | 512 Mb | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 31mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3V | 30 | 28F512M29EW | 64 | YES | 1mm | 3/3.3V | 2.7V | 512Mb 64M x 8 32M x 16 | Non-Volatile | 2.7V~3.6V | 32MX16 | 16 | Asynchronous | 0.000225A | 100 ns | 8 | YES | YES | YES | 512 | 16/32words | YES | YES | FLASH | Parallel | 100ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL064LABBHI030 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | 2017 | FL-L | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | IT ALSO HAVE X1 MEMORY WIDTH | 24-TBGA | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 16MX4 | 4 | 67108864 bit | SERIAL | 108MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
25AA320A-I/ST | Microchip Technology | 0.6427 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 32 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 40 | 25AA320A | 8 | 0.65mm | 50 ns | 32Kb 4K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS45S16400J-6BLA1 | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 54 | EAR99 | 1 | 8mm | ROHS3 Compliant | 54 | AUTO/SELF REFRESH | 54-TFBGA | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 3.3V | 54 | YES | 0.8mm | 3V | Not Qualified | 3.6V | 3-STATE | 5.4ns | 64Mb 4M x 16 | Volatile | 0.08mA | 3V~3.6V | 4MX16 | 16 | 67108864 bit | 16b | 166MHz | COMMON | NO | 4096 | YES | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT28HC64B-70JI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C TC | EEPROM | AT28HC64 | 32-PLCC (13.97x11.43) | 70ns | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms |
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