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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage REACH SVHC Reach Compliance Code Min Supply Voltage Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Operating Mode Height Seated (Max) HTS Code Number of Functions Nominal Supply Current Max Frequency JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch Supply Voltage-Min (Vsup) Qualification Status Power Supplies Supply Voltage-Max (Vsup) Voltage Supplier Device Package Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Programmable Type Data Retention Time-Min Endurance Write Protection I/O Type
    XC17S30XLPD8I XC17S30XLPD8I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 Obsolete Not Applicable 8 EAR99 9.3599mm Non-RoHS Compliant Contains Lead 8 8-DIP (0.300, 7.62mm) not_compliant 7.62mm Through Hole -40°C~85°C CMOS SYNCHRONOUS 4.5974mm 1 e0 DUAL 3.3V XC17S30XL 8 NO 2.54mm 3V Not Qualified 3.3V 3.6V 3-STATE 300kb 0.005mA 3V~3.6V 1 MEMORY CIRCUIT 10MHz 0.00005A OTP COMMON
    AT17LV010-10JU AT17LV010-10JU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Surface Mount Tube 1997 yes Active 2 (1 Year) 20 5V 9.04mm ROHS3 Compliant Lead Free Tin No 20 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 20-LCC (J-Lead) 2-Wire, Serial No SVHC 1 Mb 10MHz 3.68mm 9.04mm Surface Mount 722.005655mg -40°C~85°C CMOS 10mA 1 10mA e3 QUAD J BEND 3.3V AT17LV010 1.27mm 5V EEPROM 3V~3.6V 1MX1 0.0002A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    XC17S200AVQ44I XC17S200AVQ44I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1999 no Obsolete 3 (168 Hours) 44 EAR99 3.3V 10mm Non-RoHS Compliant Contains Lead No 44 44-TQFP 10mm Surface Mount -40°C~85°C CMOS 1.2mm 8542.32.00.61 1 e0 TIN LEAD QUAD GULL WING 225 3.3V 30 XC17S200A 44 YES 0.8mm 3V 3.6V 3-STATE 2Mb 0.015mA 3V~3.6V 1335840X1 1 1335840 bit CONFIGURATION MEMORY SERIAL 0.001A OTP COMMON
    AT17LV002-10TQU AT17LV002-10TQU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Tray 1997 yes Active 3 (168 Hours) 44 10mm ROHS3 Compliant Tin 44 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 44-TQFP 2-Wire, Serial 2 Mb 15MHz 10mm Surface Mount -40°C~85°C CMOS SYNCHRONOUS 1.2mm 1 10mA e3 QUAD GULL WING 260 3.3V 40 AT17LV002 0.8mm 3V Not Qualified 3.3/5V 3.6V EEPROM 3V~3.6V 4.5V~5.5V 2MX1 1 0.00035A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    AT17LV010A-10PU AT17LV010A-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Tube 1996 yes Active 1 (Unlimited) 8 9.271mm ROHS3 Compliant No 8 ALSO OPERATES AT 5V SUPPLY 8-DIP (0.300, 7.62mm) 2-Wire, Serial No SVHC 1 Mb 33MHz 7.62mm Through Hole -40°C~85°C CMOS 5.334mm 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV010A 2.54mm 3V 3.3/5V 3.6V EEPROM 3V~3.6V 4.5V~5.5V 1MX1 1 Serial EEPROM HARDWARE
    AT17LV256-10NI AT17LV256-10NI Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Surface Mount Tube 1997 Obsolete 1 (Unlimited) 85°C -40°C Non-RoHS Compliant Contains Lead 8 8-SOIC (0.154, 3.90mm Width) 2-Wire, Serial 5.5V 4.5V 256 kb Surface Mount -40°C~85°C 10mA 10mA 12.5MHz AT17LV256 8-SOIC 256Kb EEPROM 3V~3.6V 4.5V~5.5V Serial EEPROM
    XC17256ELVO8C XC17256ELVO8C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2000 Obsolete 1 (Unlimited) 8 EAR99 4.9276mm Non-RoHS Compliant Contains Lead 8 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 8-SOIC (0.154, 3.90mm Width) not_compliant 3.937mm Surface Mount 0°C~70°C CMOS SYNCHRONOUS 1 e0 DUAL GULL WING 225 3.3V 30 XC17256EL 8 YES 1.27mm 3V Not Qualified 3.3V 3.6V 3-STATE 256Kb 0.005mA 3V~3.6V 256KX1 1 262144 bit CONFIGURATION MEMORY SERIAL 15MHz 0.00005A OTP COMMON
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