Items : %s%s
ADC
Contact Plating
- Copper, Silver, Tin
- Gold
- Gold, Silver
- Gold, Tin
- Lead, Silver, Tin
- Lead, Tin
- Silver, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.A.5.A.1
- 3A001.A.5.A.3
- 3A001.A.5.A.4
- 3A001.A.5.A.5
- 3A001A5A1
- 3A001A5A3
- 3A001A5A4
- 3A001A5A5
- 3A991.C.1
- 3A991.C.2
- 3A991.C.3
- 3A991.C.4
- 3A991C2
- 3A991C3
- 5A991.B
- 5A991.B.1
- 5A991.G
- 5A991B
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 3 Weeks
- 30 Weeks
- 35 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
Feature
- Digital Window Comparator, GPIO, Oscillator
- Interleavable, Simultaneous Sampling
- Internal Oscillator
- Internal Oscillator, PGA
- Internal Oscillator, PGA, Temperature Sensor
- Internal Oscillator, Temperature Sensor
- PGA
- PGA, Selectable Address
- PGA, Selectable Address, Temperature Sensor
- PGA, Simultaneous Sampling
- PGA, Simultaneous Sampling, Temperature Sensor
- PGA, Temperature Sensor
- Selectable Address
- Selectable Address, Simultaneous Sampling
- Selectable Address, Simultaneous Sampling, True Bipolar
- Selectable Address, Temperature Sensor
- Simultaneous Sampling
- Simultaneous Sampling, Temperature Sensor
- Simultaneous Sampling, True Bipolar
- Temperature Sensor
- Temperature Sensor, True Bipolar
- True Bipolar
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 11 hours ago)
- ACTIVE (Last Updated: 12 hours ago)
- ACTIVE (Last Updated: 14 hours ago)
- ACTIVE (Last Updated: 16 hours ago)
- ACTIVE (Last Updated: 18 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 2 hours ago)
- ACTIVE (Last Updated: 2 months ago)
- ACTIVE (Last Updated: 2 weeks ago)
- ACTIVE (Last Updated: 21 hours ago)
- ACTIVE (Last Updated: 23 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 4 hours ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 hours ago)
- CONTACT ADI (Last Updated: 1 month ago)
- CONTACT ADI (Last Updated: 1 week ago)
- CONTACT ADI (Last Updated: 6 days ago)
- LAST TIME BUY (Last Updated: 1 month ago)
- LAST TIME BUY (Last Updated: 3 days ago)
- LAST TIME BUY (Last Updated: 3 months ago)
- LAST TIME BUY (Last Updated: 4 days ago)
- LAST TIME BUY (Last Updated: 6 days ago)
- LIFEBUY (Last Updated: 2 days ago)
- LIFEBUY (Last Updated: 3 days ago)
- LIFEBUY (Last Updated: 3 weeks ago)
- LIFEBUY (Last Updated: 4 days ago)
- LIFEBUY (Last Updated: 5 days ago)
- NRND (Last Updated: 1 day ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 days ago)
- OBSOLETE (Last Updated: 1 day ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 3 months ago)
- OBSOLETE (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 4 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- OBSOLETE (Last Updated: 6 days ago)
- PREVIEW (Last Updated: 2 months ago)
- Production (Last Updated: 1 day ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 days ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 days ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 days ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
- PRODUCTION (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 6 days ago)
Manufacturer Package Identifier
- 8-uMAX
- DBV (R-PDSO-G6
- L72.10x10E
- PAP
- RGZ(PVQFN-N48)
- RGZ(S-PVQFN-N48)
- RU-28
- WB SOIC
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 5 (48 Hours)
Mount
- Surface Mount
- Surface Mount, Through Hole
- Surface Mount, Wire
- Through Hole
Mounting Feature
- SURFACE MOUNT
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 10
- 100
- 12
- 124
- 128
- 14
- 140
- 144
- 16
- 18
- 192
- 196
- 198
- 20
- 221
- 24
- 256
- 257
- 28
- 292
- 30
- 32
- 323
- 36
- 38
- 40
- 44
- 48
- 5
- 52
- 56
- 6
- 60
- 64
- 68
- 72
- 8
- 80
- 84
- 88
Number of Terminations
- 10
- 100
- 12
- 121
- 124
- 128
- 14
- 140
- 144
- 16
- 18
- 192
- 196
- 198
- 20
- 24
- 256
- 257
- 28
- 292
- 30
- 32
- 323
- 36
- 38
- 40
- 44
- 48
- 5
- 52
- 56
- 6
- 60
- 64
- 68
- 72
- 8
- 80
- 84
- 88
Operating Temperature
- -10°C~70°C
- -10°C~85°C
- -20°C~70°C
- -20°C~75°C
- -20°C~85°C
- -25°C~85°C
- -35°C~85°C
- -40°C~105°C
- -40°C~124°C
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~175°C
- -40°C~70°C
- -40°C~75°C
- -40°C~80°C
- -40°C~84°C
- -40°C~85°C
- -40°C~85°C TA
- -45°C~125°C
- -50°C~105°C
- -50°C~125°C
- -55°C~105°C
- -55°C~115°C TA
- -55°C~125°C
- -55°C~125°C TA
- -55°C~175°C
- -55°C~210°C
- -55°C~225°C
- -55°C~85°C
- 0°C~105°C
- 0°C~125°C
- 0°C~70°C
- 0°C~75°C
- 0°C~85°C
- 20°C~75°C
Package / Case
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 10-VFDFN Exposed Pad
- 10-VFDFN Exposed Pad, CSP
- 10-WFDFN Exposed Pad
- 10-XFQFN
- 10-XFQFN Exposed Pad
- 100-LFBGA
- 100-TQFP Exposed Pad
- 12-TSSOP (0.118, 3.00mm Width)
- 12-WFBGA, WLBGA
- 12-WFDFN Exposed Pad
- 12-WQFN Exposed Pad
- 121-TFBGA
- 124-VFTLA Dual Rows, Exposed Pad
- 128-LQFP Exposed Pad
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 14-SOIC (0.295, 7.50mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-WFDFN Exposed Pad
- 140-BFBGA
- 144-FBGA, FCBGA
- 144-LFBGA
- 144-LFBGA, CSPBGA
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-SSOP (0.209, 5.30mm Width)
- 16-TFSOP (0.118, 3.00mm Width)
- 16-TFSOP (0.118, 3.00mm Width) Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width)
- 16-VFQFN Exposed Pad
- 16-VQFN Exposed Pad
- 16-WFDFN Exposed Pad
- 16-WFQFN Exposed Pad
- 16-WFQFN Exposed Pad, CSP
- 16-WQFN Exposed Pad
- 18-CDIP (0.300, 7.62mm)
- 18-DIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 196-LFBGA
- 196-LFBGA Exposed Pad
- 20-CDIP (0.300, 7.62mm)
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SOIC (0.209, 5.30mm Width)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.154, 3.90mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 20-WQFN Exposed Pad
- 24-CDIP (0.300, 7.62mm)
- 24-DIP (0.300, 7.62mm)
- 24-FLGA
- 24-SOIC (0.209, 5.30mm Width)
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-SSOP (0.209, 5.30mm Width)
- 24-TSSOP (0.173, 4.40mm Width)
- 24-VFQFN Exposed Pad
- 24-WFDFN Exposed Pad
- 24-WFQFN Exposed Pad
- 256-BGA, CSPBGA
- 257-LFBGA
- 28-CDIP (0.600, 15.24mm)
- 28-CLCC
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.154, 3.90mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-VQFN Exposed Pad
- 28-WFQFN Exposed Pad
- 292-BGA
- 292-BGA Exposed Pad
- 30-TFSOP (0.173, 4.40mm Width)
- 32-CDIP (0.900, 22.86mm)
- 32-LQFP
- 32-TQFP
- 32-TSSOP (0.240, 6.10mm Width)
- 32-VFQFN Exposed Pad
- 32-VFQFN Exposed Pad, CSP
- 32-VQFN Exposed Pad
- 32-WFQFN Exposed Pad
- 32-WFQFN Exposed Pad, CSP
- 36-BSOP (0.295, 7.50mm Width)
- 36-SSOP (0.209, 5.30mm Width)
- 38-TFSOP (0.173, 4.40mm Width)
- 38-WFQFN Exposed Pad
- 40-CDIP (0.600, 15.24mm)
- 40-DIP (0.600, 15.24mm)
- 40-VFQFN Exposed Pad
- 40-VFQFN Exposed Pad, CSP
- 40-WFQFN Exposed Pad
- 40-WFQFN Exposed Pad, CSP
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 48-LQFP
- 48-PowerTQFP
- 48-TFSOP (0.240, 6.10mm Width)
- 48-TQFP
- 48-TQFP Exposed Pad
- 48-VFQFN Exposed Pad
- 48-VFQFN Exposed Pad, CSP
- 48-WFQFN Exposed Pad
- 48-WFQFN Exposed Pad, CSP
- 52-LQFP
- 52-QFP
- 52-TQFP Exposed Pad
- 52-WFQFN Exposed Pad
- 56-VFQFN Exposed Pad
- 56-VFQFN Exposed Pad, CSP
- 56-WFQFN Exposed Pad
- 6-TSSOP, SC-88, SOT-363
- 6-WDFN Exposed Pad
- 6-WFDFN Exposed Pad
- 60-WFQFN Exposed Pad
- 64-LQFP
- 64-PowerTQFP
- 64-TQFP
- 64-TQFP Exposed Pad
- 64-VFQFN Exposed Pad
- 64-VFQFN Exposed Pad, CSP
- 64-WFQFN Exposed Pad
- 64-WFQFN Exposed Pad, CSP
- 68-CLCC
- 68-TQFN Exposed Pad
- 68-VFQFN Exposed Pad
- 72-VFQFN Exposed Pad
- 72-VFQFN Exposed Pad, CSP
- 8-DIP (0.300, 7.62mm)
- 8-SMD, Gull Wing
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-VDFN Exposed Pad
- 8-VFDFN Exposed Pad
- 8-VFSOP (0.091, 2.30mm Width)
- 8-WDFN Exposed Pad
- 8-WFDFN Exposed Pad
- 8-XFQFN
- 80-LQFP
- 80-TQFP Exposed Pad
- BGA
- CDIP
- D
- DFN
- DIP
- LCC
- LFCSP EP
- LQFP
- MSOP
- PDIP
- PLCC
- QFN
- QFN EP
- QFP
- QSOP
- SC
- SC-74A, SOT-753
- SOIC
- SOIC N
- SOIC W
- SOT-23
- SOT-23-6
- SOT-23-6 Thin, TSOT-23-6
- SOT-23-8
- SOT-23-8 Thin, TSOT-23-8
- SSOP
- TFSOP
- TQFP
- TSOT
- TSSOP
- UMAX
- VQFN
- VSSOP
Packaging
- Box
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Rail/Tube
- Strip
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- AD9208
- AD9680
- ADS869x
- Automotive
- Automotive, ADI0012
- Automotive, AEC-Q100
- Automotive, AEC-Q100, microPOWER™
- Automotive, AEC-Q101
- iCMOS®
- iCMOS®, PulSAR®
- LinCMOS™
- LTC2311-16
- microPort™
- microPOWER™
- Military, MIL-STD-883
- PowerWise®
- PulSAR®
- SoftSpan™
- SpeedPlus™
- THine®
- µModule®
Supplier Device Package
- 10-LFCSP-WD (3x3)
- 10-MSOP
- 10-MSOP-EP
- 10-TDFN-EP (3x3)
- 10-uMAX
- 124-VTLA (9x9)
- 144-CSPBGA (10x10)
- 16-CDIP
- 16-MSOP
- 16-QFN (3x3)
- 16-SOIC
- 16-TSSOP
- 196-BGA (12x12)
- 20-PDIP
- 20-PLCC (9x9)
- 20-SOIC
- 20-SSOP
- 20-TQFN (4x4)
- 20-TSSOP
- 20-WLCSP (2.39x2.39)
- 24-CDIP
- 24-HQFN (4x4)
- 24-QFN (4x4)
- 24-SOIC
- 24-SSOP
- 28-CDIP
- 28-SOIC
- 28-SSOP
- 28-TQFN (5x5)
- 32-HVQFN (7x7)
- 32-LFCSP-VQ (5x5)
- 32-LFCSP-WQ (5x5)
- 40-HVQFN (6x6)
- 48-LFCSP-VQ (7x7)
- 48-QFN (7x7)
- 52-QFN (7x8)
- 56-HVQFN
- 56-LFCSP-VQ (8x8)
- 56-QFN (8x8)
- 64-HVQFN (9x9)
- 64-LFCSP (9x9)
- 64-LFCSP-WQ (9x9)
- 64-LQFP (10x10)
- 64-SMT (9x9)
- 64-TQFP-EP (10x10)
- 72-LFCSP-VQ (10x10)
- 72-QFN (10x10)
- 8-DFN (2x3)
- 8-MSOP
- 8-PDIP
- 8-SOIC
- 80-LQFP (14x14)
- TSOT-23-6
Surface Mount
- NO
- YES
Terminal Finish
- GOLD
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Gold/Nickel (Au/Ni)
- MATTE TIN
- MATTE TIN (800)
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- NOT SPECIFIED
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Lead/Silver (Sn62Pb36Ag2)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
- Through Hole
Tolerance
- 10%
- 4%
Type
- General Purpose
Weight
- 1.098005g
- 1.182714g
- 130.010913mg
- 138.005479mg
- 186.993455mg
- 2.26799g
- 2.386605g
- 203.804722mg
- 23.700201mg
- 241.793083mg
- 26.506804mg
- 274.706879mg
- 29.993795mg
- 378.607881mg
- 4.535924g
- 446.703436mg
- 496.003257mg
- 5.896701mg
- 62.99264mg
- 665.986997mg
- 730.794007mg
- 800.987426mg
- 850.995985mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Height | Width | Mounting Type | Operating Temperature | Technology | Input Type | Max Supply Voltage (DC) | Min Supply Voltage (DC) | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Input Voltage | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Signal to Noise Ratio (SNR) | Operating Temperature (Max) | Operating Temperature (Min) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Max Power Dissipation | Number of Elements | Configuration | Feature | Polarity | Number of Circuits | Min Input Voltage | Power Dissipation | Number of Inputs | Power Consumption | Dual Supply Voltage | Input Capacitance | Resolution | Number of Analog Inputs | Number of Bits | Supply Type | Number of Converters | Number of Analog In Channels | Output Bit Code | Number of A/D Converters | Analog Input Voltage-Max | Output Format | Negative Supply Voltage-Nom | Analog Input Voltage-Min | Sampling Rate | Conversion Rate | Integral Nonlinearity (INL) | Differential Nonlinearity | Converter Type | Linearity Error-Max (EL) | Sample and Hold / Track and Hold | Conversion Time-Max | Architecture | Reference Type | Data Interface | Sampling Rate (Per Second) | Voltage - Supply, Analog | Voltage - Supply, Digital | Ratio - S/H:ADC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AD7367BRUZ-RL7 | Analog Devices Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | PRODUCTION (Last Updated: 1 month ago) | Tape & Reel (TR) | iCMOS® | no | Active | 1 (Unlimited) | 24 | EAR99 | 7.8mm | ROHS3 Compliant | Contains Lead | Tin | 24 | 24-TSSOP (0.173, 4.40mm Width) | SPI | Surface Mount | -40°C~85°C | Single Ended | 2 | 3V | e3 | GULL WING | 260 | 16.5V | 40 | AD7367 | 24 | YES | 0.65mm | 76 dB | 4 | Analog to Digital Converters | Not Qualified | 88.8mW | 2 | MUX-S/H-ADC | Selectable Address, Simultaneous Sampling, True Bipolar | Bipolar, Unipolar | 2.5V | 88.7mW | 80.7mW | 13pF | 1.75 B | 14 | Analog, Digital, Dual | 2 | 2 | SERIAL | -16.5V | 1 Msps | 3.5 LSB | 0.9 LSB | ADC, SUCCESSIVE APPROXIMATION | TRACK | 0.68μs | SAR | External, Internal | SPI, DSP | 500k | ±11.5V~16.5V | 5V | 1:1 | |||||||||||||||||||||||||||||||||||||
 |
TSA7887BRZ | Silicon Labs | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2015 | Obsolete | 1 (Unlimited) | RoHS Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | unknown | Surface Mount | -40°C~125°C | Single Ended | 71 dB | 4.3mW | MUX-S/H-ADC | Unipolar | 1, 2 | 1.5 B | 12 | Single | OFFSET BINARY | 1 | 125 ksps | ADC, SUCCESSIVE APPROXIMATION | SAR | External, Internal | SPI | 125k | 2.7V~5.25V | 2.7V~5.25V | 1:1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TC7109CPL | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Through Hole | Tube | 2006 | yes | Active | 1 (Unlimited) | 40 | EAR99 | 52.4256mm | ROHS3 Compliant | Lead Free | No | 40 | 40-DIP (0.600, 15.24mm) | Parallel, Serial | 5.5V | No SVHC | 4.5V | 4.06mm | 14.097mm | Through Hole | 0°C~70°C | CMOS | Differential | 1 | 700μA | e3 | Matte Tin (Sn) | 5V | TC7109 | 40 | 2.54mm | 1 | Analog to Digital Converters | 1.23W | ADC | Bipolar | 1.23W | 1.23W | 5V | 1.5 B | 12 | Dual | 1 | BINARY | 4V | -5V | 10 sps | 10 sps | 0.024% | Dual Slope | External | Parallel | 30 | |||||||||||||||||||||||||||||||||||||||||||||
 |
MCP3201T-CI/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 5.5V | 2.7V | 3.9mm | Surface Mount | -40°C~85°C | CMOS | Pseudo-Differential | 1 | e3 | DUAL | GULL WING | 260 | 5V | 40 | MCP3201 | 8 | 1 | Analog to Digital Converters | 5V | S/H-ADC | Unipolar | 1.5 B | 12 | Single | 1 | BINARY | 5.6V | 100 ksps | 100 ksps | 2 LSB | 1 LSB | ADC, SUCCESSIVE APPROXIMATION | SAMPLE | SAR | External | SPI | 100k | 2.7V~5.5V | 2.7V~5.5V | 1:1 | ||||||||||||||||||||||||||||||||||||||||||
 |
AD7492BR-5 | Analog Devices, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 1 (Unlimited) | 24 | EAR99 | Non-RoHS Compliant | 24 | SOIC | not_compliant | 7.5mm | CMOS | 2.65mm | 1 | e0 | DUAL | GULL WING | 240 | 5V | 30 | 24 | INDUSTRIAL | YES | 85°C | -40°C | Analog to Digital Converters | Not Qualified | 3/5V | 1 | 12 | 1 | BINARY | 2.5V | PARALLEL, WORD | 1.25 Msps | ADC, SUCCESSIVE APPROXIMATION | 0.0305% | TRACK | 0.68μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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KAD5512P-12Q48 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Tray | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~85°C | CMOS | Differential | 0.9mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | NOT SPECIFIED | 1.8V | NOT SPECIFIED | KAD5512P | 48 | YES | 0.5mm | S-PQCC-N48 | S/H-ADC | 1 | 12 | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | PARALLEL, WORD | ADC, PROPRIETARY METHOD | SAMPLE | 0.008μs | SAR | Internal | LVDS - Parallel, Parallel | 125M | 1.7V~1.9V | 1.7V~1.9V | 1:1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "ADC-207MM-C") |
ADC-207MM-C | Datel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Non-RoHS Compliant | 8542.39.00.01 | OFFSET BINARY | ADC, FLASH METHOD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TLV0834CDRG4 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape and Reel | 1 (Unlimited) | 14 | EAR99 | 85°C | -40°C | RoHS Compliant | Lead Free | No | 14 | SOIC | SPI | 3.6V | 2.7V | 3.9mm | CMOS | 3.6V | 2.7V | 1 | 200μA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 3.3V | 14 | COMMERCIAL | YES | 4 | Analog to Digital Converters | 3.3V | Unipolar | 1 B | 8 | Single | 1 | 4 | BINARY | 3.65V | SERIAL | -0.05V | 41 ksps | 41 ksps | 0.5 LSB | ADC, SUCCESSIVE APPROXIMATION | 0.0977% | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CS5361-KZ | Cirrus Logic | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | 24 | EAR99 | 7.8mm | RoHS Compliant | No | 24 | TSSOP | 4.4mm | 1.1mm | 1 | 22mA | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 240 | 5V | 30 | 24 | COMMERCIAL | YES | 0.65mm | 70°C | -10°C | Analog to Digital Converters | 5V | 3 B | 2 | 24 | 2 | SERIAL | 1.9V | 192 ksps | ADC, DELTA-SIGMA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MAX1202ACAP+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 1999 | yes | Active | 1 (Unlimited) | 20 | EAR99 | 7.2mm | ROHS3 Compliant | Lead Free | 20 | 20-SSOP (0.209, 5.30mm Width) | 5.29mm | Surface Mount | 0°C~70°C | CMOS | Differential, Single Ended | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 5V | 30 | MAX1202 | 20 | YES | 0.65mm | Analog to Digital Converters | Not Qualified | 3/55GND/-5V | MUX-S/H-ADC | 4, 8 | 12 | 8 | BINARY, 2'S COMPLEMENT BINARY | 1 | 2.048V | SERIAL | -5V | -2.048V | ADC, SUCCESSIVE APPROXIMATION | TRACK | SAR | External, Internal | SPI | 133k | ±5V 5V | 2.7V~5.25V | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||
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MCP37D11-200E/TE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Active | ROHS3 Compliant | 121-TFBGA | Surface Mount | -40°C~125°C | Differential | MUX-S/H-ADC | 8 | 12 | OFFSET BINARY | 1 | ADC, PROPRIETARY METHOD | Pipelined | Internal | LVDS - Parallel, Parallel | 200M | 1.14V~1.89V | 1.14V~1.89V | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
ADC10464CIWM | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | no | Obsolete | 3 (168 Hours) | 28 | EAR99 | 5V | Non-RoHS Compliant | Contains Lead | Lead, Tin | No | 28 | 28-SOIC (0.295, 7.50mm Width) | 5.5V | 4.5V | 7.5mm | Surface Mount | -40°C~85°C | CMOS | Single Ended | 2.65mm | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 260 | 5V | ADC10464 | 28 | 61 dB | 4 | Analog to Digital Converters | 5V | 235mW | MUX-S/H-ADC | Unipolar | 150mW | 1.25 B | 10 | Analog, Digital | 4 | BINARY | 1 | 800 ksps | 800 ksps | 0.5 LSB | SAMPLE | Flash | External, Internal | Parallel | 800k | 5V | 1:1 |
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AD7367BRUZ-RL7 Analog Devices Inc.
14 Bit 0.65mm Tin ADC iCMOS? Series AD7367 16.5V 24-TSSOP (0.173, 4.40mm Width)
Price: 0.0000
RFQ -
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TC7109CPL Microchip Technology
12 Bit 2.54mm ADC TC7109 5V 40-DIP (0.600, 15.24mm)
Price: 0.0000
RFQ -
MCP3201T-CI/SN Microchip Technology
12 Bit Tin ADC MCP3201 5V 8-SOIC (0.154, 3.90mm Width)
Price: 0.0000
RFQ -
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MAX1202ACAP+ Maxim Integrated
12 Bit 0.65mm ADC MAX1202 5V 20-SSOP (0.209, 5.30mm Width)
Price: 0.0000
RFQ -
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ADC10464CIWM Texas Instruments
10 Bit Lead, Tin ADC ADC10464 5V 28-SOIC (0.295, 7.50mm Width)
Price: 0.0000
RFQ
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